| 國立成功大學 |
2008-04 |
The micro-impact fracture behavior of lead-free solder ball joints
|
Huang, Y. L.; Lin, Kwang-Lung; Liu, D. S. |
| 國立成功大學 |
2008-04 |
Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn-9Zn/Cu sandwich
|
Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2008-03-20 |
IMC formation on BGA package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge solder balls
|
Lin, Kwang-Lung; Shih, Po-Cheng |
| 國立成功大學 |
2008-01 |
Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2008 |
Effect of current density and plating time on the morphology of copper electrodeposits on an AFM tip
|
Lin, Kwang-Lung; Chen, S. Y.; Mohanty, Udit-Surya |
| 國立成功大學 |
2008 |
Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders
|
Lai, R. S.; Lin, Kwang-Lung; Salam, B. |
| 國立成功大學 |
2007-10 |
The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing
|
Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2007-09 |
Electrochemical corrosion study of Sn-XAg-0.5Cu alloys in 3.5% NaCl solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2007-07-31 |
Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210 degrees C reflow
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2007-07 |
The polarization characteristics of Pb-free Sn-8.5Zn-XAg-0.1A1-0.05Ga alloy in 3.5% NaCl solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2007-05-15 |
Effects of aging treatment on mechanical properties and microstructure of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder
|
Hsuan, Teng-Chun; Lin, Kwang-Lung |
| 國立成功大學 |
2007-05 |
Microstructure evolution during electromigration between Sn-9Zn solder and Cu
|
Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2007-04 |
Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2007-01 |
Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 degrees C
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2006-12 |
Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates
|
Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2006-12 |
Lead-free solder implementation: Reliability, alloy development, new technology - Foreword
|
Chawla, Nik; Chada, Srinivas; Kang, Sung K.; Kao, C. Robert; Lin, Kwang-Lung; Lucas, Jim; Turbini, Laura |
| 國立成功大學 |
2006-09-28 |
Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2006-06-08 |
Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy
|
Chen, Kang-I; Cheng, Shou-Chang; Wu, Sean; Lin, Kwang-Lung |
| 國立成功大學 |
2006-05 |
Dissolution behavior of Cu and Ag substrates in molten solders
|
Yeh, Po-Yi; Song, Jenn-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2006-03 |
The effect of alloying element gallium on the polarization characteristics of Pb-free Sn-Zn-Ag-Al-XGa solders in NaCl solution
|
Mohanty, Udit S.; Lin, Kwang-Lung |
| 國立成功大學 |
2006-02-06 |
The atomic-scale studies of the behavior of the crystal dissolution in a molten metal
|
Yu, Chang-Ho; Lin, Kwang-Lung |
| 國立成功大學 |
2006-01 |
The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu
|
Liu, Nai-Shuo; Lin, Kwang-Lung |
| 東方設計學院 |
2006 |
Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy
|
陳剛毅; Chen, Kang-I; 鄭壽昌; Cheng, Shou-Chang; 吳信賢; Wu, Sean; Lin, Kwang-Lung; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2006 |
Potentiodynamic polarization measurement of Sn-8.5Zn-XAl-0.5Ga alloy in 3.5% NaCl solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2005-10-15 |
Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution
|
Mohanty, Udit-Surya; Lin, Kwang-Lung |
