臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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	臺大學術典藏NTU Scholars

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Institution	Date	Title	Author
義守大學	2017-06	競技桌球暫停策略之個案分析	許銘華;陳明坤;周資眾; Ming-Hua Hsu;Ming-Kun Chen;Tz-Chung Chou
義守大學	2015-07	Fabrication and characterization of low-cost ultrathin flexible polyimide interposer	Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu
義守大學	2014-02	Failure analysis of EOS-induced damage at final electrical testing	Ming-Kun Chen;Yu-Jung Huang;Chi-Chan Cheng;Yi-Lung Lin;Shen-Li Fu
義守大學	2013-01	DESIGN AND FABRICATION OF ULTRA-THIN FLEXIBLE SUBSTRATE	Ming-Kun Chen;Yu-Jung Huang;Yi-Lung Lin;Shen-Li Fu
義守大學	2013-01	Fabrication and Characterization of Cu-Plated Fine Pitch Patterns on Flexible Polyimide	Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Ling-Sheng Jang
義守大學	2012-11	Design of AC-Coupled Circuit for High-speed Interconnects	Chun-Wei Huang;Kai-Jen Liu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin
義守大學	2012-11	Micro-scale Cu metallization on polyimide substrate for high-speed interconnects	Ya-Hui Tseng;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin
義守大學	2012-10	Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging	Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu
義守大學	2012-02	3D Contactless Capacitive Coupled Interconnection Circuit Design	Yu-Jung Huang;Shen-Li Fu;Yi-Lung Lin;Ming-Kun Chen
義守大學	2011-10	Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications	Sheng-Feng Hsiao;Ming-Kun Chen;Yi-Lung Lin;Yu-Jung Huang;Shen-Li Fu
義守大學	2011-01	Simulation and Modeling of Capacitive Coupling Interconnection For 3D Integration	Kai-Jen Liu;Chun-Wei Huang;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin
義守大學	2010-05	Hardware Implementation of RFID Mutual Authentication Protocol	Yu-Jung Huang;Ching-Chien Yuan;Ming-Kun Chen;Wei-Cheng Lin;Hsien-Chiao Teng
義守大學	2009-08	Design of patch antenna for RFID reader applications	Pei-Ju Lin;Hsien-Chiao Teng;Yu-Jung Huang;Ming-Kun Chen
義守大學	2008/01/24	Experimental approach to analyze failure site condition in final testing of bga package	Hsiang-Chen Hsu;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2008-12	Implementation and application of UHF RFID antenna	Chia-Hao Yen;Pei-Ju Lin;Ming-Kun Chen;Yu-Jung Huang;Wei-Cheng Lin
義守大學	2007-11	Study of contact degradation in final testing for BGA socket	Hsien-Chiao Teng;Ming-Kun Chen;Chia-Hao Yen;Yu-Jung Huang;Shen-Li Fu
義守大學	2007-11	Planar antennas on flexible substrate for wireless applications	Hsien-Chiao Teng;Pei-Ju Lin;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2006-12	Electrical Modeling and Circuit Simulation for SI Analysis of High-Speed FC-BGA	Ming-Kun Chen;Yu-Jung Huang;Shu-Jung Hou;Yu-Hung Chen;Chien-Kai Yang;Shen-Li Fu
義守大學	2006-10	Electrical characterization of FCBGA package based on measurement approach for high-speed SOC applications	Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang
義守大學	2006-04	Nondestructive analysis of interconnection in two-die BGA using TDR	Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang
義守大學	2002-12	Failure analysis of BGA package by a TDR approach	Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang;I-Chih Wu
義守大學	2002-12	Electrical characterization of BGA test socket for high-speed applications	Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang;Li-Kuei Fang
義守大學	2002	高速負載板電磁干擾分析與故障模型建立之研究	陳明坤; ming-kun chen

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