臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
元智大學	Sep-18	Interfacial Microstructure and Mechanical Reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) Reactive System: P Content Effects	Ying-Syuan Wu; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Sep-18	TEM Characterization of Cu Self-annealing and Direct Proof of Pinhole Formation Mechanism in a Cu Film	Cheng-En Ho; Chang-Chih Chen; Cheng-Hsien Yang; Pei-Tzu Lee; Wan-Zhen Hsieh; Ying-Syuan Wu
元智大學	Sep-17	TEM Investigation of Interfacial Microstructure and Fracture Mode of the Sn-Ag-Cu/Ni Joint System	Cheng-En Ho; Ming-Kai Lu; Pei-Tzu Lee; Yu-Hsuan Huang; Wei-Ling·Chou
元智大學	Sep-16	Real-time Study of Electromigration in Sn Blech Structure	Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Pei-Tzu Lee
元智大學	Oct-18	High-speed Cu electrodeposition and reliability of Cu pillar bumps in high-temperature storage	Pei-Tzu Lee; Ying-Syuan Wu; Cheng-Yu Lee; Hung-Cheng Liu; Cheng-En Ho
元智大學	Mar-18	High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo
元智大學	Jun-22	Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure	Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Shao-Chin Tseng; Mau-Tsu Tang; Ching-Yu Chiang; C.R. Kao; Cheng-En Ho
元智大學	Jun-17	High-speed Cu Electrodeposition and Its Solderability	Pei-Tzu Lee; Ying-Syuan Wu; Pin-Chung Lin; Chang-Chih Chen; Wan-Zhen Hsieh; Cheng-En Ho
元智大學	Jun-15	Effect of Pd(P) Thickness on the Soldering Reaction between Sn-3Ag-0.5Cu Alloy and Ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu Metallization Pad	Cheng-En Ho; Ling-Huang Hsu; Cheng-Hsien Yang; Ting-Chun Yeh; Pei-Tzu Lee
元智大學	Jan-19	Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy	Yu-Hsuan Huang; Wan-Zhen Hsieh; Pei-Tzu Lee; Ying-Syuan Wu; Tsai-Tung Kuo; Cheng-En Ho

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