臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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	臺大學術典藏NTU Scholars

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Institution	Date	Title	Author
元智大學	Sep-18	Interfacial Microstructure and Mechanical Reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) Reactive System: P Content Effects	Ying-Syuan Wu; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Sep-18	TEM Characterization of Cu Self-annealing and Direct Proof of Pinhole Formation Mechanism in a Cu Film	Cheng-En Ho; Chang-Chih Chen; Cheng-Hsien Yang; Pei-Tzu Lee; Wan-Zhen Hsieh; Ying-Syuan Wu
元智大學	Sep-17	TEM Investigation of Interfacial Microstructure and Fracture Mode of the Sn-Ag-Cu/Ni Joint System	Cheng-En Ho; Ming-Kai Lu; Pei-Tzu Lee; Yu-Hsuan Huang; Wei-Ling·Chou
元智大學	Sep-16	Real-time Study of Electromigration in Sn Blech Structure	Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Pei-Tzu Lee
元智大學	Oct-18	High-speed Cu electrodeposition and reliability of Cu pillar bumps in high-temperature storage	Pei-Tzu Lee; Ying-Syuan Wu; Cheng-Yu Lee; Hung-Cheng Liu; Cheng-En Ho
元智大學	Mar-18	High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo
元智大學	Jun-22	Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure	Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Shao-Chin Tseng; Mau-Tsu Tang; Ching-Yu Chiang; C.R. Kao; Cheng-En Ho
元智大學	Jun-17	High-speed Cu Electrodeposition and Its Solderability	Pei-Tzu Lee; Ying-Syuan Wu; Pin-Chung Lin; Chang-Chih Chen; Wan-Zhen Hsieh; Cheng-En Ho
元智大學	Jun-15	Effect of Pd(P) Thickness on the Soldering Reaction between Sn-3Ag-0.5Cu Alloy and Ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu Metallization Pad	Cheng-En Ho; Ling-Huang Hsu; Cheng-Hsien Yang; Ting-Chun Yeh; Pei-Tzu Lee
元智大學	Jan-19	Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy	Yu-Hsuan Huang; Wan-Zhen Hsieh; Pei-Tzu Lee; Ying-Syuan Wu; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Jan-19	Significant improvement of the thermal stability and electrochemical corrosion resistance of the Au/Pd surface finish through catalytic modification	Yu-Hsuan Huang; Shu-Ping Yang; Pei-Tzu Lee; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Feb-19	Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad	Ying-Syuan Wu; Pei-Tzu Lee; Wan-Zhen Hsieh; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Aug-21	High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)	Pei-Tzu Lee; Chih-Hao Chang; Cheng-Yu Lee; Ying-Syuan Wu; Cheng-Hsien Yang; Cheng-En Ho
元智大學	Aug-16	Comparative Study between Au/Pd/Cu and Au/Pd(P)/Cu Films in Soldering Applications	Pei-Tzu Lee; Wan-Zhen Hsieh; Ting-Chun Yeh; Hsiao-Keng Wang; Cheng-En Ho
元智大學	Aug-16	Electromigration in 3D-IC Scale Cu/Sn/Cu Solder Joints	Cheng-En Ho; Pei-Tzu Lee; Chih-Nan Chen; Cheng-Hsien Yang
東海大學	2019	酸對生活於容器性積水蝌蚪的影響	李珮慈; Pei-Tzu Lee
元智大學	2018-11-16	Synchrotron X-ray Nanodiffraction Study of Tin Whisker Growth	Wan-Zhen Hsieh; Pei-Tzu Lee; Wei-Ling·Chou; Ching-Shun Ku; Cheng-En Ho
元智大學	2018-11-16	Characterization of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 Using Synchrotron White X-ray Laue Diffraction	Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Ching-Shun Ku; C. Robert Kao; Cheng-En Ho
元智大學	2018	高速電鍍銅及其於電子封裝之應用	李珮慈; Pei-Tzu Lee
元智大學	2017-10-25	Significant Improvement of Electrochemical Corrosion and Thermal Stability of EPIG (Au/Pd) Surface Finish by Depositing A Au Nanolayer	Yu-Hsuan Huang; Yu-Xuan Wang; Pei-Tzu Lee; Shu-Ping Yang; Tsai-Tung Kuo; Cheng-En Ho
元智大學	2017-04-25	Strong Effect of Plating Current Density on the Cu Pillar Microstructure and Its Adhesion with An ABF Substrate	Ying-Syuan Wu; Pei-Tzu Lee; Wei-Yan Shih; Sheng-Wei Lin; Cheng-En Ho
元智大學	2017-04-25	Solderability between Sn-3Ag-0.5Cu Alloy and Cu Pillars Deposited via Different Plating Current Densities	Pei-Tzu Lee; Ying-Syuan Wu; Ying-Hua Weng; Sheng-Wei Lin; Cheng-En Ho
元智大學	2016-10-26	High-Current-Density Electroplating Cu and Its Solderability	Pei-Tzu Lee; Chang-Chih Chen; Ying-Syuan Wu; Pin-Chung Lin; Cheng-En Ho
元智大學	2016-10-26	Microstructure and Its Reliability of High-speed Cu Electrodeposition	Ying-Syuan Wu; Chang-Chih Chen; Pei-Tzu Lee; Hung-Cheng Liu; Cheng-En Ho
元智大學	2016-10-26	Reliability Testing of Au/Pd/Cu and Au/Pd(P)/Cu Surface Finishes at High Temperature Storage	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Tsai-Tung Kuo

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