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Institution	Date	Title	Author
國立東華大學	2007	Electrical resistivity and interfacial behavior of Bi-Ag/Cu high temperature solder joints	Song,J. M.; Chuang,Hsin-Yi; Lew,Kar-Kit
國立東華大學	2007	Fabrication of thermal reduced metallic nano-wires on titanium dioxide	Song,J. M.; Chen,I. G.; Tung,H. T.
國立東華大學	2006-07	Interfacial Behaviour between Bi-Ag based Solders and Ni substrate	Song,J. M.; Chuang,H. Y.
國立東華大學	2006-07	Tensile properties of Bi-Ag new Pb-free die attach solder and the joints	Song,J. M.; Wen,T. X.; Wu, Z. M.
國立東華大學	2006-03	Deposition of Conductive Films on Electronic Substrates by Using Gold Nanopowders	Song, J. M.; Chen, I. G.; Kao,T. H.; Dong,T. Y.; Wu,H. H.
國立東華大學	2006-03	Properties of Au Deposits on Electronic Substrates by Utilizing Nanoparticle Suspensions	Song,J. M.; Chen, I. G.; Kao,T. H.; Dong,T. Y.; Wu,H. H.
國立東華大學	2006	Microstructural Characteristics and Vibration Fracture Properties of Sn-Ag-Cu-TM (TM=Co, Ni and Zn) Alloys	Song,J. M.; Huang,C. F.; Chuang, H. Y.
國立東華大學	2006	Interfacial Reactions between Bi-Ag High Temperature Solders and Metallic Substrates	Song,J. M.; Chuang,H. Y.; Wu,Z. M.
國立東華大學	2006	Dissolution Behavior of Cu and Ag Substrates in Molten Solders	Song,J. M.; Lin,K. L.; Yeh,P. Y.
國立東華大學	2006	Effect of Zn Content on the Vibration Fracture Behavior of Sn-Zn and Sn-Zn-Bi Solders	Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,Y. L.
國立東華大學	2006	Variable Eutectic Temperature Caused by Inhomogeneous Solute Distribution in Sn-Zn System	Song,J. M.; Wu,Z. M.
國立東華大學	2006	Continuity and Adhesion of Gold Deposits on Electronic substrates by Utilizing Nanoparticle Suspensions	Song,J. M.; Chen,I. G.; Dong,T. Y.; Wu, H. H.
國立東華大學	2006	The Influence of Al Content and Annealing on Vibration Fracture Properties of Wrought Mg-Al-Zn Alloys	Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,H. W.
國立東華大學	2006	Sedimentation of Intermetallics in Liquid Lead-free Solders	Song,J. M.; Chuang, H. Y.; Shen,Y. L.
國立東華大學	2005-04	A Study on Vibration Induced Deformation Structure of Sn-based Pb-free Solders	Song,J. M.; Chen,L. H.; Lui,T. S.
國立東華大學	2005	Compositional Effects on the Microstructure and Vibration Fracture Properties of Sn-Zn-Bi alloys	Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,Y. L.
國立東華大學	2005	Role of Ag in the Formation of Interfacial Intermetallic Phases in Sn-Zn Soldering	Song,J. M.; Liu,P. C.; Lin,K. L.; Shih,C. L.
國立東華大學	2005	Tin Whiskers of Bulk Solders Generated under Resonance	Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,Y. L.
國立東華大學	2005	Effect of Zn Content on the Vibration Fracture Behavior of Sn-Zn and Sn-Zn-Bi Solders	Song,J. M.; Lui,T. S.; Chang,Y. L.; Chen,L. H.
國立東華大學	2005	Dissolution Behavior of Cu and Ag Substrates in Molten Solders	Song,J. M.; Lin,K. L.; Yeh,P. Y.
國立東華大學	2004-06	Wetting Interaction between Pb-free Sn-Zn Series Solders and Cu, Ag Substrates	Song,J. M.; Liu,P. C.; Lin, K. L.
國立東華大學	2004	Effect of Microstructural Refinement on Tensile Behavior of the AC9A Aluminum Alloy Suffering Thermal Shock Fatigue	Song,J. M.; Lui,T. S.; Lin,H. M.; Chen,L. H.; Kao,I. H.
國立東華大學	2004	Vibration Behavior of a Precipitation-hardening Aluminum Alloy under Resonance	Song, J. M.; Lui,T. S.; Chen,T. F.; Chen,L. H.; Horng,J. H.
國立東華大學	2004	Microstructural Characteristics and Vibration Fracture Behavior of Sn-Zn-Ag Solder Alloys	Song, J. M.; Lui,T. S.; Chen,L. H.; Lan,G. F.
國立東華大學	2004	Double Peritectic Behavior of Ag-Zn Intermetallics in Sn-Zn-Ag Solder Alloys	Song,J. M.; Lin,K. L.
國立東華大學	2004	Investigation of Vibration Fracture Behavior of Sn-Ag-Cu Solders under Resonance	Song,J. M.; Li,F. I.; Chen,L. H.; Lui,T. S.
國立東華大學	2004	Effects of Matrix Structure on the Resonant Vibration Behaviors of Spheroid Graphite Cast Iron	Song,J. M.; Lin,S. C.; Chen,L. H.; Lui,T. S.
國立東華大學	2004	Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys	Song,J. M.; Liu,N. S.; Lin,K. L.
國立東華大學	2004	Vibration Fracture Behavior of Sn-Bi Solder Alloys with Various Bi Contents	Song,J. M.; Chang,Y. L.; Chen,L. H.; Lui,T. S.
國立東華大學	2004	Resonant Vibration Behavior of an Al-3.8Cu-0.8Li-0.3Mg Alloy	Song, J. M.; Tan,B. H.; Chen,L. H.; Lui,T. S.
國立東華大學	2004	Effects of Ga additions on the Microstructure and Properties of Sn-Zn-Ga Solder Alloys	Song,J. M.; Lin,K. L.; Lui,N. S.; Liu,P. C.
國立東華大學	2004	Behavior of Eutectic Sn-Zn, Sn-Ag and Sn-Pb Solders under High Current Stressing Conditions	Song,J. M.; Tsai,T. Y.; Chen,L. H.; Lui ,T. S.
國立東華大學	2003-03	Effects of Copper Content on Vibration Fracture Behavior of Sn-Ag-Cu Solders	Song,J. M.; Lui,T. S.; Chen,L. H.; Li,F. I.
國立東華大學	2003	Resonant Vibration Behavior of Lead-free Solders	Song,J. M.; Lui,T. S.; Tsai,D. Y.; Chen,L. H.
國立東華大學	2003	Behavior of Intermetallics in Liquid Sn-Zn-Ag Solder Alloys	Song, J. M.; Lin,K. L.
國立東華大學	2003	Study on the Vibration Fracture Resistance of Ferritic Spheroidal Graphite Cast Iron suffer from Aqueous Ambient Environments	Song, J. M.; Song,Y. H.; Chen,L. H.; Lui,T. S.
國立東華大學	2003	Examination on the Growth Textures of Eutectic Cementite of Various Morphologies	Song,J. M.; Chen,L. H.; Lui,T. S.
國立東華大學	2003	Microstructure and Tensile Properties of Sn-Zn-Ag Lead Free Solder Alloys	Song,J. M.; Lan,G. F.; Chen,L. H.; Lui,T. S.
國立東華大學	2003	Resonant Vibration Behavior of Lead-free Solders	Song,J. M.; Lui,T. S.; Tsai,D. Y.; Chen,L. H.
國立東華大學	2003	Dissolution of Cu and Ag Substrates by Molten Lead-free Solders	Song,J. M.; Lin,K. L.; Yeh,P. Y.

Showing items 41-80 of 80 (2 Page(s) Totally)
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