|
English
|
正體中文
|
简体中文
|
0
|
|
???header.visitor??? :
50959944
???header.onlineuser??? :
973
???header.sponsordeclaration???
|
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"su francis"???jsp.browse.items-by-author.description???
Showing items 1-5 of 5 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 國立成功大學 |
2004-03 |
Three-dimensional modeling of mold filling in microelectronics encapsulation process
|
Chang, Rong-Yeu; Yang, Wen-Hsien; Hwang, Sheng-Jye; Su, Francis |
| 國立成功大學 |
2003-06 |
Computer-aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance
|
Lee, Hung-Lung; Chang, Shyang-Jye; Hwang, Sheng-Jye; Su, Francis; Chen, S. K. |
| 國立成功大學 |
2003-03 |
An efficient solution for wire sweep analysis in IC packaging
|
Su, Jerry; Hwang, Sheng-Jye; Su, Francis; Chen, Shou-Kang |
| 國立成功大學 |
2003-01 |
Computer-aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance
|
Lee, Hung-Lung; Chang, Shyang-Jye; Hwang, Sheng-Jye; Su, Francis; Chen, S. K. |
| 國立成功大學 |
2000-12 |
Prediction of paddle shift via 3-D TSOP modeling
|
Su, Francis; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn-Yuan |
Showing items 1-5 of 5 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
