|
English
|
正體中文
|
简体中文
|
2831195
|
|
???header.visitor??? :
33206115
???header.onlineuser??? :
1049
???header.sponsordeclaration???
|
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"tian tian"???jsp.browse.items-by-author.description???
Showing items 1-4 of 4 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 臺大學術典藏 |
2020-01-06T03:11:42Z |
Utilization of original phosphogypsum for the preparation of foam concrete
|
Tian, Tian; Yan, Yun; Hu, Zhihua; Xu, Yuanyuan; Chen, Yanping; Shi, Jian; YAN-PING CHEN |
| 國立交通大學 |
2019-04-03T06:41:32Z |
Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
|
Chang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立交通大學 |
2018-08-21T05:56:50Z |
Study of Discrete Voids Formation in Flip-Chip Solder Joints due to Electromigration Using In-Situ 3D Laminography and Finite-Element Modeling
|
Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立交通大學 |
2017-04-21T06:55:10Z |
Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling
|
Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
Showing items 1-4 of 4 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
