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Showing items 1-5 of 5 (1 Page(s) Totally)
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| 國立交通大學 |
2020-03-02T03:23:28Z |
Adhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer/Metal Hybrid Bonding
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Lu, Cheng-Hsien; Yang, Yi-Lun; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng |
| 國立交通大學 |
2019-08-02T02:15:29Z |
Asymmetric Wafer-Level Polyimide and Cu/Sn Hybrid Bonding for 3-D Heterogeneous Integration
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Lu, Cheng-Hsien; Jhu, Shu-Yan; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng |
| 國立交通大學 |
2019-04-02T05:59:00Z |
Adhesion and Material Properties Between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3-D Integration
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Lu, Cheng-Hsien; Kho, Yi-Tung; Chen, Chiao-Pei; Tsai, Bin-Ling; Chen, Kuan-Neng |
| 國立臺灣大學 |
2011 |
Programmable one-pot synthesis of tumor-associated carbohydrate antigens Lewis X dimer and KH-1 epitopes
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Tsai, Bin-Ling; Han, Jeng-Liang; Ren, Chien-Tai; Wu, Chung-Yi; Wong, Chi-Huey |
| 國立臺灣大學 |
2009 |
合成路易士X二聚體與KH-1抗原分子
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蔡秉霖; Tsai, Bin-Ling |
Showing items 1-5 of 5 (1 Page(s) Totally)
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