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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
臺大學術典藏 2022-03-22T15:04:52Z Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices Tsai, Chin Hao; Huang, Wei Chen; Kao, Chengheng Robert
臺大學術典藏 2021-11-21T23:18:57Z Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Tsai, Chin Hao; Huang, Wei Chen; Chew, Ly May; Schmitt, Wolfgang; Li, Jiahui; Nishikawa, Hiroshi; Kao, C. R.
臺大學術典藏 2021-09-21T23:19:32Z A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn Tsai, Chin Hao; Lin, Sze Yin; Lee, Pei Tzu; C. ROBERT KAO

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