|
English
|
正體中文
|
简体中文
|
Total items :2833128
|
|
Visitors :
34216557
Online Users :
1738
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
|
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"tsai hsin chun"
Showing items 21-28 of 28 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page
| 國立成功大學 |
2009-06-15 |
Association between serotonin transporter availability and overall rating scores of quality of life in healthy volunteers
|
Tsai, Hsin-Chun; Yeh, Tzung-Lieh; Hsieh, Ming-Hong; Lee, I-Hui; Chen, Kao-Ching; Chen, Po-See; Yang, Yen-Kuang; Yao, Wei-Jen |
| 國立臺灣大學 |
2009 |
身高對學生綜合分析能力的影響以「男女生第一次夢遺/初經年齡」為工具變數分析
|
蔡欣純; Tsai, Hsin-Chun |
| 中原大學 |
2007-11 |
元素分割對Sn-Ag-Cu錫球合金之潛變行為的影響 The Influences of Element Partition on Creep Responses of Sn-Ag-Cu Solder Joints
|
鍾文仁;蔡新春;黃靜慈 ;Jong, Wen-Ren;Tsai, Hsin-Chun;Huang, Ching-Tzu |
| 中原大學 |
2007-11 |
Sn-Ag-Cu錫球合金之PBGA封裝體疲勞强度的比較 Comparison with the Fatigue-Strength Predictions on PBGA Packages of Sn-Ag-Cu Solder
|
鍾文仁;蔡新春;黃靜慈; Jong, Wen-Ren;Tsai, Hsin-Chun;Huang, Ching-Tzu |
| 中原大學 |
2002-12 |
覆晶構裝受熱循環負載作用之疲勞壽命分析與探討 The Analysis on the Fatigue Life of Flip Chip Package under Cyclic Thermomechanical Loading
|
鍾文仁;蔡新春;邱建嘉;蕭振安; Jong, Wen-Ren;Tsai, Hsin-Chun;Chiu, Chien-Chia;Hsiao, Chen-An |
| 中原大學 |
2002-12 |
覆晶底部充填現象之研究 The Study of Underfill Phenomena of Flip Chip Packages
|
鍾文仁;賴成展;蔡新春;陳隆泰; Jong, Wen-Ren;Lai, Cheng-Chang;Tsai, Hsin-Chun;Chen, Long-Tai |
| 中原大學 |
2002-12 |
覆晶構裝受熱循環負載作用之疲勞壽命分析與探討 The Analysis on the Fatigue Life of Flip Chip Package Under Cyclic Thermomechanical Loading
|
鍾文仁;蔡新春;邱建嘉;蕭振安 ;Jong, Wen-Ren;Tsai, Hsin-Chun;Chiu, Chien-Chia;Hsiao, Chen-An |
| 中原大學 |
2002-12 |
覆晶底部充填現象之研究 The Study of Underfill Phenomena of Flip Chip Packages
|
鍾文仁;賴成展;蔡新春;陳隆泰 ;Jong, Wen-Ren;Lai, Cheng-Chang;Tsai, Hsin-Chun;Chen, Long-Tai |
Showing items 21-28 of 28 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page
|
