English  |  正體中文  |  简体中文  |  Total items :2831143  
Visitors :  33182183    Online Users :  1095
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
About TAIR

Browse By

News

Copyright

Related Links

"tseng tzyy jang"

Return to Browse by Author
Sorting by Title Sort by Date

Showing items 1-7 of 7  (1 Page(s) Totally)
1 
View [10|25|50] records per page

Institution Date Title Author
國立交通大學 2020-10-05T02:01:56Z Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration Chou, Tzu-Chieh; Yang, Kai-Ming; Li, Jian-Chen; Yu, Ting-Yang; Yang, Yu-Tao; Hu, Han-Wen; Liu, Yu-Wei; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng
國立交通大學 2020-10-05T02:01:28Z Non-Planarization Cu-Cu Direct Bonding and Gang Bonding with Low Temperature and Short Duration in Ambient Atmosphere Chou, Tzu-Chieh; Yang, Kai-Ming; Li, Jian-Chen; Yu, Ting-Yang; Chung, Ying-Ting; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng
國立交通大學 2019-12-13T01:12:49Z Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package Yang, Kai-Ming; Chou, Tzu-Chieh; Ko, Cheng-Ta; Lin, Chen-Hao; Chen, Yu-Hua; Tseng, Tzyy-Jang; Wu, Wen-Wei; Chen, Kuan-Neng
國立交通大學 2019-04-02T06:04:30Z Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems Pan, Yu-Ming; Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng
國立交通大學 2018-08-21T05:56:59Z Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration Yang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng
國立交通大學 2018-08-21T05:56:49Z Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package Ko, Cheng-Ta; Yang, Kai-Ming; Lin, Jim-Wein; Wang, Chih-Lun; Chou, Tzu-Chieh; Yang, Yu-Tao; Yu, Ting-Yang; Chen, Yu-Hua; Chen, Kuan-Neng; Tseng, Tzyy-Jang
國立交通大學 2018-08-21T05:52:44Z Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Chang, Yu-Wei; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng

Showing items 1-7 of 7  (1 Page(s) Totally)
1 
View [10|25|50] records per page