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机构 日期 题名 作者
國立交通大學 2020-10-05T02:01:56Z Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration Chou, Tzu-Chieh; Yang, Kai-Ming; Li, Jian-Chen; Yu, Ting-Yang; Yang, Yu-Tao; Hu, Han-Wen; Liu, Yu-Wei; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng
國立交通大學 2020-10-05T02:01:28Z Non-Planarization Cu-Cu Direct Bonding and Gang Bonding with Low Temperature and Short Duration in Ambient Atmosphere Chou, Tzu-Chieh; Yang, Kai-Ming; Li, Jian-Chen; Yu, Ting-Yang; Chung, Ying-Ting; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng
國立交通大學 2019-12-13T01:12:49Z Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package Yang, Kai-Ming; Chou, Tzu-Chieh; Ko, Cheng-Ta; Lin, Chen-Hao; Chen, Yu-Hua; Tseng, Tzyy-Jang; Wu, Wen-Wei; Chen, Kuan-Neng
國立交通大學 2019-04-02T06:04:30Z Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems Pan, Yu-Ming; Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng
國立交通大學 2018-08-21T05:56:59Z Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration Yang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng
國立交通大學 2018-08-21T05:56:49Z Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package Ko, Cheng-Ta; Yang, Kai-Ming; Lin, Jim-Wein; Wang, Chih-Lun; Chou, Tzu-Chieh; Yang, Yu-Tao; Yu, Ting-Yang; Chen, Yu-Hua; Chen, Kuan-Neng; Tseng, Tzyy-Jang
國立交通大學 2018-08-21T05:52:44Z Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Chang, Yu-Wei; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng

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