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"tsui by"
Showing items 6-15 of 54 (6 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:43:20Z |
Surface-processing-enhanced copper diffusion into fluorosilicate glass
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Tsui, BY; Fang, KL; Lee, SD |
| 國立交通大學 |
2014-12-08T15:43:19Z |
Impact of interface nature on deep sub-micron Al-plug resistance
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Tsui, BY; Yang, TJ; Ku, TK |
| 國立交通大學 |
2014-12-08T15:41:32Z |
Investigation of Cu/TaN metal gate for metal-oxide-silicon devices
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Tsui, BY; Huang, CF |
| 國立交通大學 |
2014-12-08T15:41:16Z |
Wide range work function modulation of binary alloys for MOSFET application
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Tsui, BY; Huang, CF |
| 國立交通大學 |
2014-12-08T15:41:01Z |
Investigation of Cu/TaN metal gate for metal-oxide-silicon devices (vol 150, pg G22, 2003)
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Tsui, BY; Huang, CF |
| 國立交通大學 |
2014-12-08T15:40:58Z |
Process sensitivity and robustness analysis of via-first dual-damascene process
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Tsui, BY; Chen, CW; Huang, SM; Lin, SS |
| 國立交通大學 |
2014-12-08T15:40:53Z |
Metal drift induced electrical instability of porous low dielectric constant film
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Fang, KL; Tsui, BY |
| 國立交通大學 |
2014-12-08T15:40:45Z |
Formation of interfacial layer during reactive sputtering of hafnium oxide
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Tsui, BY; Chang, HW |
| 國立交通大學 |
2014-12-08T15:40:42Z |
Stability investigation of single-wafer process by using a spin etcher
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Kang, TK; Wang, CC; Tsui, BY; Yang, WL; Chien, FT; Yang, SY; Chang, CY; Li, YH |
| 國立交通大學 |
2014-12-08T15:40:41Z |
Via-filling capability of copper film by CVD
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Lin, CL; Chen, PS; Lin, YC; Tsui, BY; Chen, MC |
Showing items 6-15 of 54 (6 Page(s) Totally)
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