|
English
|
正體中文
|
简体中文
|
总笔数 :0
|
|
造访人次 :
51095724
在线人数 :
1066
教育部委托研究计画 计画执行:国立台湾大学图书馆
|
|
|
"tsui by"的相关文件
显示项目 6-15 / 54 (共6页)
1 2 3 4 5 6 > >>
每页显示[10|25|50]项目
| 國立交通大學 |
2014-12-08T15:43:20Z |
Surface-processing-enhanced copper diffusion into fluorosilicate glass
|
Tsui, BY; Fang, KL; Lee, SD |
| 國立交通大學 |
2014-12-08T15:43:19Z |
Impact of interface nature on deep sub-micron Al-plug resistance
|
Tsui, BY; Yang, TJ; Ku, TK |
| 國立交通大學 |
2014-12-08T15:41:32Z |
Investigation of Cu/TaN metal gate for metal-oxide-silicon devices
|
Tsui, BY; Huang, CF |
| 國立交通大學 |
2014-12-08T15:41:16Z |
Wide range work function modulation of binary alloys for MOSFET application
|
Tsui, BY; Huang, CF |
| 國立交通大學 |
2014-12-08T15:41:01Z |
Investigation of Cu/TaN metal gate for metal-oxide-silicon devices (vol 150, pg G22, 2003)
|
Tsui, BY; Huang, CF |
| 國立交通大學 |
2014-12-08T15:40:58Z |
Process sensitivity and robustness analysis of via-first dual-damascene process
|
Tsui, BY; Chen, CW; Huang, SM; Lin, SS |
| 國立交通大學 |
2014-12-08T15:40:53Z |
Metal drift induced electrical instability of porous low dielectric constant film
|
Fang, KL; Tsui, BY |
| 國立交通大學 |
2014-12-08T15:40:45Z |
Formation of interfacial layer during reactive sputtering of hafnium oxide
|
Tsui, BY; Chang, HW |
| 國立交通大學 |
2014-12-08T15:40:42Z |
Stability investigation of single-wafer process by using a spin etcher
|
Kang, TK; Wang, CC; Tsui, BY; Yang, WL; Chien, FT; Yang, SY; Chang, CY; Li, YH |
| 國立交通大學 |
2014-12-08T15:40:41Z |
Via-filling capability of copper film by CVD
|
Lin, CL; Chen, PS; Lin, YC; Tsui, BY; Chen, MC |
显示项目 6-15 / 54 (共6页)
1 2 3 4 5 6 > >>
每页显示[10|25|50]项目
|
