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Showing items 1-2 of 2 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立交通大學 |
2017-04-21T06:50:04Z |
Generic Rules to Achieve Bump Electromigration Immortality for 3D IC Integration
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Chen, Hsiao-Yun; Shih, Da-Yuan; Wei, Cheng-Chang; Tung, Chih-Hang; Hsiao, Yi-Li; Yu, Douglas Cheng-Hua; Liang, Yu-Chun; Chen, Chih |
國立交通大學 |
2017-04-21T06:49:13Z |
Electromigration Immortality of Purely Intermetallic Micro -bump for 3D Integration
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Chen, Hsiao-Yun; Tung, Chih-Hang; Hsiao, Yi-Li; Wu, Jyun-lin; Yeh, Tung-Ching; Lin, Larry Liang-Chen; Chen, Chih; Yu, Douglas Cheng-Hua |
Showing items 1-2 of 2 (1 Page(s) Totally) 1 View [10|25|50] records per page
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