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"tung han chuang"的相关文件
显示项目 56-65 / 205 (共21页)
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| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
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Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)
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TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D. |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices
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Chu, A. K.; Lin, J. Y.; Wang, M. L.; Fan, C. C.; Shue, H. S.; Chuang, T. H.; Chen, S. Y.; Chiu, C. H.; Lin, S. F.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Nontraditional grain refinement through phase transformation in an Al-Zn alloy
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Chuang, T.-W.; Chen, S.-J.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Discontinuous coarsening of discontinuous precipitate in a Ni-7.5 at.% In alloy
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Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
The morphology of discontinuous precipitation on the surface of NiIn and NiSn alloys
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Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Electrical and Magnetic Studies on Grain Boundary Segregation in a NI-3AT.%Sn Alloy
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Yao, Y.D.; Chuang, T.H.; Lee, C.K.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Discontinuous coarsening and dissolution in an Fe13.5at.%Zn solid solution
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Chuang, T.-H.; Gust, W.; Predel, B.; Fournelle, R.A.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
The mutual effects of boron, zirconium and aluminium on grain boundary segregation in Ni3Al intermetallic compounds
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Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Grain boundary pest of boron- doped Niin3Al at 1200 °C
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Chuang, T.H.; Pan, Y.C.; Hsu, S.E.; TUNG-HAN CHUANG |
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