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教育部委託研究計畫      計畫執行:國立臺灣大學圖書館
 
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機構 日期 題名 作者
臺大學術典藏 2020-05-12T02:53:29Z Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:29Z Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004) TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D.
臺大學術典藏 2020-05-12T02:53:29Z Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices Chu, A. K.; Lin, J. Y.; Wang, M. L.; Fan, C. C.; Shue, H. S.; Chuang, T. H.; Chen, S. Y.; Chiu, C. H.; Lin, S. F.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:28Z Nontraditional grain refinement through phase transformation in an Al-Zn alloy Chuang, T.-W.; Chen, S.-J.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:28Z Discontinuous coarsening of discontinuous precipitate in a Ni-7.5 at.% In alloy Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:28Z The morphology of discontinuous precipitation on the surface of NiIn and NiSn alloys Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:28Z Electrical and Magnetic Studies on Grain Boundary Segregation in a NI-3AT.%Sn Alloy Yao, Y.D.; Chuang, T.H.; Lee, C.K.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:28Z Discontinuous coarsening and dissolution in an Fe13.5at.%Zn solid solution Chuang, T.-H.; Gust, W.; Predel, B.; Fournelle, R.A.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:27Z The mutual effects of boron, zirconium and aluminium on grain boundary segregation in Ni3Al intermetallic compounds Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:27Z Grain boundary pest of boron- doped Niin3Al at 1200 °C Chuang, T.H.; Pan, Y.C.; Hsu, S.E.; TUNG-HAN CHUANG

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