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Institution Date Title Author
國立成功大學 2021-04 A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions Yang;Hung-Chun;Chiu;Tz-Cheng
國立成功大學 2021 Numerical Implementation of a Unified Viscoplastic Model for Considering Solder Joint Response under Board-Level Temperature Cycling Yang;Hung-Chun;Chiu;Tz-Cheng
國立成功大學 2018-09 An experimental setup for characterizing subcritical debonding of materials interface under mixed mode fatigue loading Chiu;Tz-Cheng;Lu;Wei;Hua;Chi-An
國立成功大學 2018-01 Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications Chen;Kuo-Shen;Yang;Tian-Shiang;Hong;Ron-Can;Chiu;Tz-Cheng;Lin;Mao-Chi
國立成功大學 2018-01 Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging Chiu;Tz-Cheng;Yeh;En-Yu

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