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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 國立臺灣科技大學 |
2005 |
The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints
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Huang, M.K.;Lee, C.;Wu, P.L.;Tzan, S.R. |
| 國立臺灣科技大學 |
2004 |
Failure behavior of small outline J lead/Sn-X (X = AgCu or Pb) solder joints under thermomechanical fatigue test
|
Wu, P.L.;Huang, M.K.;Lee, C.;Tzan, S.R. |
| 國立臺灣科技大學 |
2004 |
Effects of printed circuit board surface finish and thermomechanical fatigue on the microstructure and mechanical strength of small outline J leads/Sn-X (X = AgCu and Pb) solder joints
|
Wu, P.L.;Huang, M.K.;Lee, C.;Tzan, S.R. |
| 國立臺灣科技大學 |
2004 |
Effects of different printed-circuit-board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued, small outline J Leads/Sn-Ag-Cu interfaces
|
Wu, P.L.;Huang, M.K.;Lee, C.Y.;Tzan, S.R. |
Showing items 1-4 of 4 (1 Page(s) Totally)
1
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