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Institution Date Title Author
國立成功大學 2008-11 Finite element model verification for packaged printed circuit board by experimental modal analysis Lee, Ying-Chih; Wang, Bor-Tsuen; Lai, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng
國立成功大學 2008-05 Structural design optimization for board-level drop reliability of wafer-level chip-scale packages Tsai, Tsung-Yueh; Lai, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng
國立成功大學 2007-10 High-G drop impact response and failure analysis of a chip packaged printed circuit board Jenq, Syh-Tsang; Sheu, H. S.; Yeh, Chang-Lin; Lai, Yi-Shao; Wu, Jenq-Dah
國立成功大學 2007-08 Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses Tsai, Tsung-Yueh; Yeh, Chang-Lin; Lai, Yi-Shao; Chen, Rong-Sheng
國立成功大學 2007-01 Transient submodeling analysis for board-level drop tests of electronic packages Tsai, Tsung-Yueh; Yeh, Chang-Lin; Lai, Yi-Shao; Chen, Rong-Sheng

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