| 臺大學術典藏 |
2005 |
Reliability assessment and sensitivity analysis of software reliability growth modeling based on software module structure
|
Lo, Jung-Hua; Huang, Chin-Yu; Chen, Ing-Yi; Kuo, Sy-Yen; Lyu, Michael R.; Lo, Jung-Hua; Huang, Chin-Yu; Chen, Ing-Yi; Kuo, Sy-Yen; Lyu, Michael R. |
| 佛光大學 |
2005-04-01 |
Reliability Assessment and Sensitivity Analysis of Software Reliability Growth Modeling Based on Software Module Structure
|
羅榮華;黃慶育; 陳英一;郭斯彥; Jung-Hua Lo; Chin-Yu Huang; Ing-Yi Chen; Sy-Yen Kuo; Michael R. Lyu |
| 佛光大學 |
2005-04-01 |
Reliability Assessment and Sensitivity Analysis of Software Reliability Growth Modeling Based on Software Module Structure
|
羅榮華;黃慶育;陳英一;郭斯彥 |
| 國立臺灣科技大學 |
2013 |
Reliability assessment for a stochastic manufacturing system with reworking actions
|
Lin, Y.-K.;Chang, P.-C. |
| 淡江大學 |
2010-05 |
Reliability Assessment for One-Shot Product with Weibull Lifetime Components
|
朱留; Pan, C.C.; Chu, L. |
| 國立成功大學 |
2012-04 |
Reliability assessment for traffic data
|
Lin, Dung-Ying; Boyles, Stephen; Valsaraj, Varunraj; Waller, S. Travis |
| 國立臺灣科技大學 |
2017 |
Reliability assessment of a multistate freight network for perishable merchandise with multiple suppliers and buyers
|
Lin, Y.-K;Yeh, C.-T;Huang, C.-F. |
| 國立臺灣科技大學 |
2014 |
Reliability assessment of a stochastic node-failure network with multiple sinks under tolerable error rate
|
Lin, Y.-K.;Huang, C.-F. |
| 國立交通大學 |
2014-12-08T15:12:46Z |
Reliability assessment of an aircraft propulsion system using IFS and OWA tree
|
Chang, K. -H.; Cheng, C. -H.; Chang, Y. -C. |
| 中原大學 |
2009-11 |
Reliability Assessment of Generation and Transmission Systems Using Fault-Tree Analysis
|
Y.Y. Hong; L.H. Lee |
| 國立交通大學 |
2014-12-08T15:46:01Z |
Reliability assessment of laminated composite plates with random strength parameters
|
Kam, TY; Chu, KH; Chang, ES |
| 元智大學 |
2008-04 |
Reliability Assessment of Sn-Pb and Pb-free Solder Joints under the Cyclic Bend and Shear Tests
|
陳永樹; Wang Ching-Shun; Fan Chentse; Chang Kuo-Chin; Pu Han-Ping |
| 元智大學 |
2007-08 |
Reliability Assessment of Sn-Pb and Pb-free Solder Joints under the Cyclic Bend and Shear Tests
|
陳永樹; Wang Ching-Shun; Fan Chentse; Chang Kuo-Chin; Pu Han-Ping |
| 國立成功大學 |
2012-09-01 |
Reliability assessment of ultra-thin HfO2 films deposited on silicon wafer
|
Fu, Wei-En; Chang, Chia-Wei; Chang, Yong-Qing; Yao, Chih-Kai; Liao, Jiunn-Der |
| 臺大學術典藏 |
2020-05-15T07:01:41Z |
Reliability assessment on earthquake early warning: A case study from Taiwan
|
Xu, Y.;Wang, J.P.;Wu, Y.-M.;Kuo-Chen, H.; Xu, Y.; Wang, J.P.; Wu, Y.-M.; Kuo-Chen, H.; YIH-MIN WU |
| 臺大學術典藏 |
2022-06-30T02:05:25Z |
Reliability assessment on earthquake early warning: A case study from Taiwan
|
Xu Y.; Wang J.P.; Wu Y.-M.; Kuo-Chen H.; Xu Y.; Wang J.P.; Wu Y.-M.; Kuo-Chen H.; HAO KUO-CHEN |
| 淡江大學 |
2000-08 |
Reliability based optimum structural design for robust performance using fuzzy formulation strategy
|
Shih, C. J.; Tseng, T. J. |
| 國立成功大學 |
2020-10 |
Reliability Characteristics of Diamond-Like Carbon as Gate Insulator for Metal-Insulator-Semiconductor Application
|
Tyan;S, -L.;Tang;H, -C.;Wu;Z, -W.;Mo;T, -S. |
| 國立成功大學 |
2020 |
Reliability Characteristics of Diamond-Like Carbon as Gate Insulator for Metal–Insulator–Semiconductor Application
|
Tyan, S.-L.;Tang, H.-C.;Wu, Z.-W.;Mo, T.-S. |
| 國立交通大學 |
2014-12-08T15:12:18Z |
Reliability characteristics of NiSi nanocrystals embedded in oxide and nitride layers for nonvolatile memory application
|
Chen, Wei-Ren; Chang, Ting-Chang; Yeh, Jui-Lung; Sze, S. M.; Chang, Chun-Yen |
| 國立交通大學 |
2020-07-01T05:22:07Z |
Reliability Characterization of Gallium Nitride MIS-HEMT Based Cascode Devices for Power Electronic Applications
|
Elangovan, Surya; Cheng, Stone; Chang, Edward Yi |
| 國立臺灣科技大學 |
2013 |
Reliability consideration with rectangle- and double-signal through silicon vias insertion in 3D thermal-aware floorplanning
|
Hsu, C.-H.;Ruan, S.-J.;Chen, Y.-J.;Kan, T.-C. |
| 淡江大學 |
2016/01/12 |
Reliability curve fitting for aging helicopter components
|
James T. Luxhoj; Huan-Jyh Shyur |
| 亞洲大學 |
2018-04 |
RELIABILITY DEGRADATION FORMULA BASED ON THE SUBSYSTEMS OF THE GENERALIZED ARRANGEMENT GRAPH
|
龔自良;KUNG, TZU-LIANG;* |
| 義守大學 |
2018-01 |
Reliability Design and Optimization Process on Through Mold Via Using Ultrafast Laser
|
Hsiang-Chen Hsu;Shih-Jeh Wu;Wen-Fei Lin;Boen Houng |
