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Institution Date Title Author
元智大學 2006-03 The Experimental Study for the Solder Joint Reliability of High I/O FCBGA’s with Thermal Loaded Bend Test 陳永樹; C.S. Wang; A.C. Shiah
元智大學 2004-08 The experimental study for the solder joint reliability of high I/O FCBGAs with thermal loaded bend test 陳永樹; C.S. Wang; A.C. Shiah
元智大學 2004-08 An Experimental Study of the Mounting Forces for Various Components Mounted on the PCB with Different Lead Free Solder Pastes 陳永樹; C.S. Wang; A.C. Shiah; Ken Lee

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