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"chiou bs"
Showing items 11-20 of 132 (14 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:46:16Z |
Antireflective coating for ITO films deposited on glass substrate
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Chiou, BS; Tsai, JH |
| 國立交通大學 |
2014-12-08T15:45:46Z |
Barrier layer effect of titanium-tungsten on the electromigration in sputtered copper films on polyimide
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Wang, HW; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:45:14Z |
The effect of substrate surface roughness on the wettability of Sn-Bi solders
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Chen, YY; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:44:43Z |
Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints
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Miao, HW; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:44:43Z |
Analysis of the dielectric characteristics for polycrystalline Ba(0.65)Sr(0.35)TiO(3) (I)-frequency dependence in the paraelectric state
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Liou, JW; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:44:43Z |
Analysis of the dielectric characteristics for polycrystalline Ba0.65Sr0.35TiO3 (II) - d.c. field dependence with a modified bias equation
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Liou, JW; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:44:33Z |
Effect of aluminum seed layer on the crystallographic texture and electromigration resistance of physical vapor deposited copper interconnect
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Chin, YL; Chiou, BS; Wu, WF |
| 國立交通大學 |
2014-12-08T15:44:24Z |
The effect of polyimide passivation on the electromigration of Cu multilayer interconnections
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Jiang, JS; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:44:11Z |
The influence of washing and calcination condition on urea-derived ceria-yttria-doped tetragonal zirconia powders
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Lin, JD; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:43:53Z |
Wettability of electroless Ni in the under bump metallurgy with lead free solder
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Young, BL; Duh, JG; Chiou, BS |
Showing items 11-20 of 132 (14 Page(s) Totally)
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