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總筆數 :2856708
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53606619
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1031
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"chiou bs"的相關文件
顯示項目 11-20 / 132 (共14頁)
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| 國立交通大學 |
2014-12-08T15:46:16Z |
Antireflective coating for ITO films deposited on glass substrate
|
Chiou, BS; Tsai, JH |
| 國立交通大學 |
2014-12-08T15:45:46Z |
Barrier layer effect of titanium-tungsten on the electromigration in sputtered copper films on polyimide
|
Wang, HW; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:45:14Z |
The effect of substrate surface roughness on the wettability of Sn-Bi solders
|
Chen, YY; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:44:43Z |
Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints
|
Miao, HW; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:44:43Z |
Analysis of the dielectric characteristics for polycrystalline Ba(0.65)Sr(0.35)TiO(3) (I)-frequency dependence in the paraelectric state
|
Liou, JW; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:44:43Z |
Analysis of the dielectric characteristics for polycrystalline Ba0.65Sr0.35TiO3 (II) - d.c. field dependence with a modified bias equation
|
Liou, JW; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:44:33Z |
Effect of aluminum seed layer on the crystallographic texture and electromigration resistance of physical vapor deposited copper interconnect
|
Chin, YL; Chiou, BS; Wu, WF |
| 國立交通大學 |
2014-12-08T15:44:24Z |
The effect of polyimide passivation on the electromigration of Cu multilayer interconnections
|
Jiang, JS; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:44:11Z |
The influence of washing and calcination condition on urea-derived ceria-yttria-doped tetragonal zirconia powders
|
Lin, JD; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:43:53Z |
Wettability of electroless Ni in the under bump metallurgy with lead free solder
|
Young, BL; Duh, JG; Chiou, BS |
顯示項目 11-20 / 132 (共14頁)
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