|
English
|
正體中文
|
简体中文
|
Total items :0
|
|
Visitors :
51296141
Online Users :
733
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
|
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"deng ic"
Showing items 1-10 of 16 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page
| 國立交通大學 |
2019-04-02T06:00:01Z |
Nitridation of fine grain chemical vapor deposited tungsten film as diffusion barrier for aluminum metallization
|
Chang, KM; Yeh, TH; Deng, IC |
| 國立交通大學 |
2019-04-02T05:59:47Z |
Amorphouslike chemical vapor deposited tungsten diffusion barrier for copper metallization and effects of nitrogen addition
|
Chang, KM; Yeh, TH; Deng, IC; Shih, CW |
| 國立交通大學 |
2014-12-08T15:48:44Z |
The characteristics of chemical vapor deposited amorphous-like tungsten film as a gate electrode
|
Chang, KM; Deng, IC; Shih, CW; Lain, KD; Fu, CM |
| 國立交通大學 |
2014-12-08T15:46:52Z |
Thermal stability of amorphous-like WNx/W bilayered diffusion barrier for chemical vapor deposited-tungsten/p(+)-Si contact system
|
Chang, KM; Deng, IC; Yeh, TH; Lain, KD; Fu, CM |
| 國立交通大學 |
2014-12-08T15:46:27Z |
Barrier characteristics of chemical vapor deposited amorphous-like tungsten silicide with in situ nitrogen plasma treatment
|
Chang, KM; Deng, IC; Yeh, TH; Shih, CW |
| 國立交通大學 |
2014-12-08T15:46:21Z |
Suppression of fluorine penetration by use of in situ stacked chemical vapor deposited tungsten film
|
Chang, KM; Deng, IC; Lin, HY |
| 國立交通大學 |
2014-12-08T15:45:58Z |
Suppression of copper diffusion through barrier metal-free hydrogen silsesquioxane dielectrics by NH3 plasma treatment
|
Chang, KM; Deng, IC; Yeh, SJ; Tsai, YP |
| 國立交通大學 |
2014-12-08T15:45:21Z |
Using NH3 plasma treatment to improve the characteristics of hydrogen silsesquioxane for copper interconnection application
|
Chang, KM; Deng, IC; Yeh, SJ; Tsai, YP |
| 國立交通大學 |
2014-12-08T15:45:15Z |
A novel pretreatment technology for organic low-dielectric material to suppress copper diffusion and improve ashing resistance
|
Chang, KM; Deng, IC; Tsai, YP; Wen, CY; Yeh, SJ; Wang, SW; Wang, JY |
| 國立交通大學 |
2014-12-08T15:43:15Z |
Using NH3 plasma pretreatment to improve the characteristics of organic spin-on low-k materials for copper metallization
|
Chang, KM; Tseng, MH; Deng, IC; Tsai, YP; Yeh, SJ |
Showing items 1-10 of 16 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page
|
