English  |  正體中文  |  简体中文  |  2830311  
???header.visitor??? :  32544596    ???header.onlineuser??? :  857
???header.sponsordeclaration???
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
???ui.leftmenu.abouttair???

???ui.leftmenu.bartitle???

???index.news???

???ui.leftmenu.copyrighttitle???

???ui.leftmenu.link???

"f y han"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1??? ???jsp.browse.items-by-author.order2???

Showing items 1-25 of 28  (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page

Institution Date Title Author
國立中山大學 2009-12 A dual-conversion zero-IF design for DVB-H RF tuner applications Y.C. Lin;Y.J. Lian;F.Y. Han;K.C. Lu;T.S. Horng;J.M. Wu
國立中山大學 2009-06 Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond F.Y. Han;K.C. Lu;T.S. Horng;J. Lin;H.H. Cheng;C.T. Chiu;C.P. Hung
國立中山大學 2009-05 Packaging effects on degrading the figure of merit of a CMOS low-noise amplifier: flip-chip versus wirebond F.Y. Han;K.C. Lu;T.S. Horng;J.Y. Li;C.C. Chen;H.H. Chen;C.T. Chiu;C.P Hung
國立高雄師範大學 2006-10 A rigorous study of package and PCB effects on W-CDMA upconverter RFICs Jian-Ming Wu;F.Y. Han;T.S. Horng; 吳建銘
國立中山大學 2006-10 A rigorous study of package and PCB effects on W-CDMA upconverter RFICs F.Y. Han; J.M. Wu; T.S. Horng; C.C. Tu
國立高雄師範大學 2006-09 A rigorous comparison of package and PCB effects on micromixer- and Gilbert mixer-based upconverter MMICs Jian-Ming Wu;F. Y. Han;J. M. Wu;T. S. Horng; 吳建銘
國立中山大學 2006-09 A rigorous comparison of package and PCB effects on micromixer- and Gilbert mixer-based upconverter MMICs F.Y. Han;J.M. Wu;T.S. Horng
國立高雄師範大學 2006-06 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications Jian-Ming Wu;F.Y. Han;T.S. Horng;J. Lin; 吳建銘
國立高雄師範大學 2006-06 Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions Jian-Ming Wu;F. Y. Han;T. S. Horng;J. Lin;C. C. Tu; 吳建銘
國立中山大學 2006-06 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications J.M. Wu;F.Y. Han; T.S. Horng; J. Lin
國立中山大學 2006-06 Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions F.Y. Han;J.M. Wu;T.S. Horng;J. Lin
國立中山大學 2006 A rigorous study of package and PCB effects on W-CDMA upconverter RFICs F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立中山大學 2006 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications J.M. Wu;F.Y. Han;T.S. Horng;J. Lin
國立高雄師範大學 2005-12 A rigorous study of package and PCB effects on W-CDMA RFICs Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu; 吳建銘
國立中山大學 2005-12 A rigorous study of package and PCB effects on W-CDMA RFICs F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立高雄師範大學 2005-11 Evaluation of package and PCB effects on RFICs in W-CDMA applications Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu; 吳建銘
國立中山大學 2005-11 Evaluation of package and PCB effects on RFICs in W-CDMA applications F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立高雄師範大學 2005-10 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications Jian-Ming Wu;F. Y. Han;T. S. Horng;J. Lin; 吳建銘
國立高雄師範大學 2005-10 Chip-Package-Board Codesign of W-CDMA RFICs Jian-Ming Wu;F. Y. Han;T. S. Horng; 吳建銘
國立中山大學 2005-10 Chip-Package-Board Codesign of W-CDMA RFICs F.Y. Han;J.M. Wu;T.S. Horng
國立中山大學 2005-10 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications J.M. Wu;F.Y. Han;T.S. Horng;J. Lin
國立中山大學 2005-10 A novel closed-form approach for comparing the Q-factor responses between the asymmetric and symmetric on-chip inductors T.S. Horng;C.H. Huang;F.Y. Han;C.J. Li
國立高雄師範大學 2005-06 Chip-package-board codesign of highly linear 3G-CDMA upconverter modules Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu;R. Chen;C.H. Chu; 吳建銘
國立中山大學 2005-06 Chip-package-board codesign of highly linear 3G-CDMA upconverter modules F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu;R. Chen;C.H. Chu
國立高雄師範大學 2004-10 Package and PCB effects on linearity of a micromixer-based W-CDMA upconverter Jian-Ming Wu;F. Y. Han;J. K. Jau;T.S. Horng; 吳建銘

Showing items 1-25 of 28  (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page