English  |  正體中文  |  简体中文  |  总笔数 :0  
造访人次 :  51363314    在线人数 :  1207
教育部委托研究计画      计画执行:国立台湾大学图书馆
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
关于TAIR

浏览

消息

著作权

相关连结

"feng ms"的相关文件

回到依作者浏览
依题名排序 依日期排序

显示项目 51-75 / 118 (共5页)
<< < 1 2 3 4 5 > >>
每页显示[10|25|50]项目

机构 日期 题名 作者
國立交通大學 2014-12-08T15:39:44Z Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallization Cheng, YL; Wang, YL; Liu, CP; Wu, YL; Lo, KY; Liu, CW; Lan, JK; Ay, C; Feng, MS
國立交通大學 2014-12-08T15:39:43Z Moisture resistance and thermal stability of fluorine-incorporation siloxane-based low-dielectric-constant material Cheng, YL; Wang, YL; Wu, YL; Liu, CP; Liu, CW; Lan, JK; O'Neil, ML; Ay, C; Feng, MS
國立交通大學 2014-12-08T15:39:16Z Effect of deposition temperature, on thermal stability in high-density plasma chemical vapor deposition fluorine-doped silicon dioxide Cheng, YL; Wang, YL; Chen, HW; Lan, JL; Liu, CP; Wu, SA; Wu, YL; Lo, KY; Feng, MS
國立交通大學 2014-12-08T15:38:56Z Optimization of post-N-2 treatment and undoped-Si-glass cap to improve metal wring delamination in deep submicron high-density plasma-fluorinated silica glass intermetal dielectric application Cheng, YL; Wang, YL; Lan, JK; Wu, SA; Chang, SC; Lo, KY; Feng, MS
國立交通大學 2014-12-08T15:37:09Z Effect of carrier gas on the structure and electrical properties of low dielectric constant SiCOH film using trimethylsilane prepared by plasma enhanced chemical vapor deposition Cheng, YL; Wang, Y; Lan, JK; Chen, HC; Lin, JH; Wu, Y; Liu, PT; Feng, MS
國立交通大學 2014-12-08T15:36:01Z Pattern effect optimized with non-native surface passivation in copper abrasive-free polishing Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:27:44Z Study of Schottky barriers on n-type GaN grown by LP-MOCVD Guo, JD; Feng, MS; Pan, FM
國立交通大學 2014-12-08T15:27:44Z Process-related instability mechanisms for the hydrogenated amorphous silicon thin film transistors Tai, YH; Su, FC; Feng, MS; Cheng, HC
國立交通大學 2014-12-08T15:27:43Z Fabrication and characterization of the Pd-silicided emitters for field-emission devices Wang, CC; Ku, TK; Feng, MS; Hsieh, IJ; Cheng, HC
國立交通大學 2014-12-08T15:27:24Z Modified double-layer PECVD passivation films for improving nonvolatile memory IC performance Lin, CF; Tseng, WT; Feng, MS; Chang, YF
國立交通大學 2014-12-08T15:27:17Z ULSI multi-layer thin film passivation processes for improving cache memory performance Lin, CF; Tseng, WT; Feng, MS; Chang, YF; Hsu, JJ
國立交通大學 2014-12-08T15:27:11Z A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP Chiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT
國立交通大學 2014-12-08T15:27:08Z Study of a common deep level in GaN Wen, TC; Lee, SC; Lee, WI; Guo, JD; Feng, MS
國立交通大學 2014-12-08T15:27:05Z Study on chemical-mechanical polishing of low dielectric constant polyimide thin films Tai, YL; Tsai, MS; Tung, IC; Dai, BT; Feng, MS
國立交通大學 2014-12-08T15:26:56Z Technology of electroplating copper with low-K material a-C : F for 0.15 mu m damascene interconnection Shieh, JM; Suen, SC; Lin, KC; Chang, SC; Dai, BT; Chen, CF; Feng, MS
國立交通大學 2014-12-08T15:26:54Z AIGaN Schottky characteristics after hybrid photo-enhanced wet and inductively coupled plasma etch Huang, WJ; Fang, CY; Wong, JS; Lee, CS; Chang, EY; Feng, MS
國立交通大學 2014-12-08T15:26:53Z AIGaN/GaN HEMT sub-bands study using low-temperature photoluminescence Fang, CY; Lin, CF; Lee, CS; Chang, EY; Feng, MS
國立交通大學 2014-12-08T15:26:17Z Low temperature polycrystalline silicon thin film transistors fabricated by electroless plating Ni induced crystallization of amorphous Si Chao, CW; Wu, YCS; Chen, YC; Hu, GR; Feng, MS
國立交通大學 2014-12-08T15:19:18Z Aplication of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection Chiu, SY; Wang, YL; Chang, SC; Feng, MS
國立交通大學 2014-12-08T15:17:43Z Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishing Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:17:35Z Study on pressure-independent Cu removal in Cu abrasive-free polishing Fang, JY; Huang, PW; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:17:12Z High-selectivity damascene chemical mechanical polishing Chiu, SY; Wang, YL; Liu, CP; Chang, SC; Hwang, GJ; Feng, MS; Chen, CF
國立交通大學 2014-12-08T15:05:05Z RADIATIVE RECOMBINATION MECHANISMS OF GAAS1-XPX FENG, MS; HSIAO, HL
國立交通大學 2014-12-08T15:04:54Z EFFECTS OF POLYSILICON GATE ON CHARACTERISTICS OF ONO CAPACITORS FENG, MS; LIANG, KC; CHANG, CY; LIN, LY
國立交通大學 2014-12-08T15:04:36Z SEMIINSULATING IRON-DOPED INDIUM-PHOSPHIDE GROWN BY LOW-PRESSURE METAL ORGANIC-CHEMICAL VAPOR-DEPOSITION WU, CC; FENG, MS; LIN, KC; CHAN, SH; CHANG, CY

显示项目 51-75 / 118 (共5页)
<< < 1 2 3 4 5 > >>
每页显示[10|25|50]项目