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"gusak a m"
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| 國立交通大學 |
2020-05-05T00:01:29Z |
Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints
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Chen, Chih; Tu, K. N.; Gusak, A. M. |
| 國立交通大學 |
2019-10-05T00:08:46Z |
A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production
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Tu, K. N.; Gusak, A. M. |
| 國立臺灣大學 |
2005-06 |
Electromigration-induced grain rotation in anisotropic conducting beta-tin
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Wu, A. T.; Gusak, A. M.; Tu, K. N.; Kao, and C. R. |
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