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Showing items 1-5 of 5 (1 Page(s) Totally)
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| 國立聯合大學 |
2010 |
Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads
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Hsi, CS; Lin, CT; Chang, TC; Wang, MC; Liang, MK |
| 國立聯合大學 |
2009 |
RF Properties of LTCC BST Thick Film Made by MicroPen
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Hu, T ; Palukuru, VK; Jantunen, H; Hsi, CS ; Safari, A |
| 國立聯合大學 |
2009 |
Low temperature sintering and dielectric properties of BaTiO3 with glass addition
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Hsiang, HI; Hsi, CS; Huang, CC; Fu, SL |
| 中國文化大學 |
2002 |
Interfacial adhesion and microstructure of thick film metallized aluminum nitride substrates
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Tsai CJ; Tseng WJ; Hsi CS |
| 中國文化大學 |
2001 |
Influence of particulate Al2O3 addition on interfacial microstructure and electrical sheet resistance of thick film metallized aluminum nitride substrates
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Tseng WJ; Tsai CJ; Hsi CS |
Showing items 1-5 of 5 (1 Page(s) Totally)
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