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"hsiao hsiang yao"的相关文件
显示项目 11-19 / 19 (共1页)
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| 國立交通大學 |
2014-12-08T15:19:45Z |
INVESTIGATION OF JOULE HEATING EFFECT IN VARIOUS STAGES OF FAILURE IN FLIP-CHIP SOLDER JOINTS UNDER ACCELERATED ELECTROMIGRATION
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Hsiao, Hsiang Yao; Chen, Chih; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:14:17Z |
Thermomigration in flip-chip SnPb solder joints under alternating current stressing
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Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:13:50Z |
Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]
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Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:11:08Z |
Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy
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Hsiao, Hsiang-Yao; Liang, S. W.; Ku, Min-Feng; Chen, Chih; Yao, Da-Jeng |
| 國立交通大學 |
2014-12-08T15:09:48Z |
Thermomigration in Pb-free SnAg solder joint under alternating current stressing
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Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:08:08Z |
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
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Liang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:03:39Z |
Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy
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Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:01:53Z |
Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy
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Hsiao, Hsiang-Yao; Chen, Chih |
| 國立成功大學 |
2014-10 |
Extremely anisotropic single-crystal growth in nanotwinned copper
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Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
显示项目 11-19 / 19 (共1页)
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