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Showing items 1-3 of 3 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立交通大學 |
2020-02-02T23:55:34Z |
Multi-Angle Bended Heat Pipe Design Using X-Architecture Routing with Dynamic Thermal Weight on Mobile Devices
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Hsiao, Hsuan-Hsuan; Chiou, Hong-Wen; Lee, Yu-Min |
國立交通大學 |
2019-06-03T01:09:17Z |
A System-Level Thermal Simulator with Automatic Meshing Techniques
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Wang, Jui-Hung; Lee, Yu-Min; Hsiao, Hsuan-Hsuan; Cheng, Liang-Chia |
國立交通大學 |
2018-08-21T05:56:59Z |
Thermal Modeling and Design on Smartphones with Heat Pipe Cooling Technique
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Chiou, Hong-Wen; Lee, Yu-Min; Hsiao, Hsuan-Hsuan; Cheng, Liang-Chia |
Showing items 1-3 of 3 (1 Page(s) Totally) 1 View [10|25|50] records per page
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