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Showing items 31-34 of 34  (2 Page(s) Totally)
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Institution Date Title Author
國立成功大學 2017-06 Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps Chen;Chiao-Wen;Chiu;Tsung-Chieh;Chiu;Ying-Ta;Lee;Chiu-Wen;Lin;Kwang-Lung
國立成功大學 2017-01 Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles Mittal;Jagjiwan;Lin;Kwang-Lung
國立成功大學 2017-01 Effects of Al, Pr additions on the wettability and interfacial reaction of Zn-25Sn solder on Cu substrate Niu;Xi;Lin;Kwang-Lung
國立成功大學 2017 Fundamentals of Solder Alloys in 3D Packaging Lin;Kwang-Lung

Showing items 31-34 of 34  (2 Page(s) Totally)
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