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Showing items 1-14 of 14 (1 Page(s) Totally)
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| 國立交通大學 |
2020-07-01T05:21:22Z |
Tensile Properties of < 111 >-Oriented Nanotwinned Cu with Different Columnar Grain Structures
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Li, Yu-Jin; Tu, King-Ning; Chen, Chih |
| 國立交通大學 |
2020-03-01 |
Tensile Properties and Thermal Stability of Unidirectionally < 111 >-Oriented Nanotwinned and < 110 >-Oriented Microtwinned Copper
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Li, Yu-Jin; Chen, Chih; Tu, King-Ning |
| 國立交通大學 |
2020-02-02T23:55:32Z |
High Electromigration Lifetimes of Nanotwinned Cu Redistribution Lines
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Tseng, I-Hsin; Li, Yu-Jin; Lin, Benson; Chang, Chia-Cheng; Chen, Chih |
| 國立交通大學 |
2020-02-02T23:55:32Z |
Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copper
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Juang, Jing Ye; Shie, Kai Cheng; Hsu, Po-Ning; Li, Yu Jin; Tu, K. N.; Chen, Chin |
| 國立交通大學 |
2020-02-02T23:55:32Z |
Highly (111)-oriented Nanotwinned Cu for High Fatigue Resistance in fan-out wafer-level packaging
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Li, Yu-Jin; Theng, Chih-Han; Tseng, I-Hsin; Chen, Chih; Lin, Benson; Chang, Chia-Cheng |
| 國立交通大學 |
2019-12-13T01:12:54Z |
High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging
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Li, Yu-Jin; Hsu, Wei-Yu; Lin, Benson; Chang, ChiaCheng; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:53Z |
Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper
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Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu
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Chen, Chih; Juang, Jing-Ye; Chang, Shih Yang; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N. |
| 國立交通大學 |
2019-04-02T06:04:30Z |
Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper
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Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:50Z |
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
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Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2018-01-24T07:40:31Z |
MOOC平台內之使用者自編系統設計
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李昱瑾; 黎漢林; Li, Yu-Jin; Li, Han-Lin |
| 國立交通大學 |
2017-04-21T06:49:18Z |
Growth of Cu6Sn5 and Cu3Sn Intermetallic compounds on (111)-, (100)-, and randomly-oriented copper films.
|
Li, Yu-Jin; Chen, Chih |
| 國立臺灣科技大學 |
2017-03 |
透過微積分學習以提升英語閱讀能力之學習平台設計
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周慧蓮; 李昱瑾; 孫之元; Chou, Hui-Lien; Li, Yu-Jin; Sun, Jerry Chih-Yuan |
| 東吳大學 |
1987 |
大學社會工作學生專業知識與技能之評估研究
|
李玉瑾; LI, YU-JIN |
Showing items 1-14 of 14 (1 Page(s) Totally)
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