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"liang mw"

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Institution Date Title Author
國立交通大學 2014-12-08T15:40:21Z Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers Liang, MW; Hsieh, TE; Chang, SY; Chuang, TH
國立交通大學 2014-12-08T15:37:14Z Electroless copper/nickel films deposited on AIN substrates Liang, MW; Hsieh, TE; Chen, CC; Hung, YT

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