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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 國立交通大學 |
2020-02-02T23:55:32Z |
High Electromigration Lifetimes of Nanotwinned Cu Redistribution Lines
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Tseng, I-Hsin; Li, Yu-Jin; Lin, Benson; Chang, Chia-Cheng; Chen, Chih |
| 國立交通大學 |
2020-02-02T23:55:32Z |
Highly (111)-oriented Nanotwinned Cu for High Fatigue Resistance in fan-out wafer-level packaging
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Li, Yu-Jin; Theng, Chih-Han; Tseng, I-Hsin; Chen, Chih; Lin, Benson; Chang, Chia-Cheng |
| 國立交通大學 |
2019-12-13T01:12:54Z |
High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging
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Li, Yu-Jin; Hsu, Wei-Yu; Lin, Benson; Chang, ChiaCheng; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:04:30Z |
Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper
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Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih |
Showing items 1-4 of 4 (1 Page(s) Totally)
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