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"lin z c"
Showing items 11-20 of 220 (22 Page(s) Totally)
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| 國立臺灣科技大學 |
2017 |
A study of patent analysis of LED bicycle light by using modified DEMATEL and life span
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Lin, Z.-C.;Hong, G.-E.;Cheng, P.-F. |
| 國立臺灣科技大學 |
2017 |
Analysis on Patent Categorization of LED Standing/Desk Lamp Patents with Considering the Position Weight
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Lin, Z.-C.;Lin, M.-H.;Hong, G.-E. |
| 國立臺灣科技大學 |
2017 |
Simplified Methodology for Ride Comfort Assessment Based on Wheel/Rail Contact Geometry Synthesis
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Wu, Y.-E.;Chien, M.-H.;Liao, K.-L.;Lin, Z.-C.;Chieng, W.-H. |
| 國立臺灣科技大學 |
2017 |
Experimental analysis on surface profile of sapphire wafer after polishing by chemical mechanical polishing
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Lin, Z.-C.;Huang, W.-S.;Ding, H.-Y. |
| 國立臺灣科技大學 |
2017 |
A study of specific down force energy and cutting depth of sapphire substrate affected by different dipping temperatures of slurry
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Lin Z.-C.; Ding H.-Y.; Chen P.-Y. |
| 國立臺灣科技大學 |
2016 |
Combination of improved cosine similarity and patent attribution probability method to judge the attribution of related patents of hydrolysis substrate fabrication process
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Lin, Z.-C;Wu, D.-W;Hong, G.-E. |
| 國立臺灣科技大學 |
2016 |
Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory
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Lin, Z.-C;Wang, R.-Y;Jhang, Z.-W. |
| 國立臺灣科技大學 |
2015 |
Investigation of abrasive removal depth of sapphire wafer for different slurry volume concentrations of chemical mechanical polishing with cross pattern polishing pad
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Lin, Z.-C.;Wang, R.-Y. |
| 國立臺灣科技大學 |
2015 |
An innovative method and experiment for fabricating bulgy shape nanochannel using AFM
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Lin, Z.-C;Jheng, H.-Y;Ding, H.-Y. |
| 國立臺灣科技大學 |
2015 |
Theoretical model of calculating cutting force and down force for nanocutting of V-shaped groove on single-crystal silicon
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Lin, Z.-C;Lin, C.-T;Hsu, Y.-C. |
Showing items 11-20 of 220 (22 Page(s) Totally)
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