| 國立臺灣科技大學 |
2017 |
A study of patent analysis of LED bicycle light by using modified DEMATEL and life span
|
Lin, Z.-C.;Hong, G.-E.;Cheng, P.-F. |
| 國立臺灣科技大學 |
2017 |
Analysis on Patent Categorization of LED Standing/Desk Lamp Patents with Considering the Position Weight
|
Lin, Z.-C.;Lin, M.-H.;Hong, G.-E. |
| 國立臺灣科技大學 |
2017 |
Simplified Methodology for Ride Comfort Assessment Based on Wheel/Rail Contact Geometry Synthesis
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Wu, Y.-E.;Chien, M.-H.;Liao, K.-L.;Lin, Z.-C.;Chieng, W.-H. |
| 國立臺灣科技大學 |
2017 |
Experimental analysis on surface profile of sapphire wafer after polishing by chemical mechanical polishing
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Lin, Z.-C.;Huang, W.-S.;Ding, H.-Y. |
| 國立臺灣科技大學 |
2017 |
A study of specific down force energy and cutting depth of sapphire substrate affected by different dipping temperatures of slurry
|
Lin Z.-C.; Ding H.-Y.; Chen P.-Y. |
| 國立臺灣科技大學 |
2016 |
Combination of improved cosine similarity and patent attribution probability method to judge the attribution of related patents of hydrolysis substrate fabrication process
|
Lin, Z.-C;Wu, D.-W;Hong, G.-E. |
| 國立臺灣科技大學 |
2016 |
Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory
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Lin, Z.-C;Wang, R.-Y;Jhang, Z.-W. |
| 國立臺灣科技大學 |
2015 |
Investigation of abrasive removal depth of sapphire wafer for different slurry volume concentrations of chemical mechanical polishing with cross pattern polishing pad
|
Lin, Z.-C.;Wang, R.-Y. |
| 國立臺灣科技大學 |
2015 |
An innovative method and experiment for fabricating bulgy shape nanochannel using AFM
|
Lin, Z.-C;Jheng, H.-Y;Ding, H.-Y. |
| 國立臺灣科技大學 |
2015 |
Theoretical model of calculating cutting force and down force for nanocutting of V-shaped groove on single-crystal silicon
|
Lin, Z.-C;Lin, C.-T;Hsu, Y.-C. |
| 國立交通大學 |
2014-12-08T15:15:56Z |
Transmission electron microscopy studies of GaAs nanostructures in InGaAs/InP matrix grown by molecular beam epitaxy
|
Lin, S. D.; Lin, Z. C.; Lee, C. P. |
| 國立交通大學 |
2014-12-08T15:14:39Z |
Mobility asymmetry in InGaAs/InAlAs heterostructures with InAs quantum wires
|
Lin, Z. C.; Hsieh, W. H.; Lee, C. P.; Suen, Y. W. |
| 國立交通大學 |
2014-12-08T15:12:46Z |
Ordering of stacked InAs/GaAs quantum-wires in InAlAs/InGaAs matrix on (100) InP substrates
|
Lin, Z. C.; Lin, S. D.; Lee, C. P. |
| 國立臺灣科技大學 |
2014 |
Abrasive removal depth for polishing a sapphire wafer by a cross-patterned polishing pad with different abrasive particle sizes
|
Lin, Z.-C.;Wang, R.-Y. |
| 國立臺灣科技大學 |
2014 |
Simulation of temperature field during nanoscale orthogonal cutting of single-crystal silicon by molecular statics method
|
Lin, Z.-C.;Lin, M.-H.;Hsu, Y.-C. |
| 國立臺灣科技大學 |
2014 |
Fabrication method and experiment study of nanoscale trapezoidal groove on sapphire substrate by using atomic force microscope under a fixed cutting depth and changed down force
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Lin, Z.-C.;Tsai, J.-S.;Hsu, Y.-C.;Lin, C.-T. |
| 國立臺灣科技大學 |
2014 |
A study of simulation of three-dimensional quasi-steady molecular statics nanoscale orthogonal cutting of single-crystal silicon material having rows of atoms with vacancy defect
|
Lin, Z.-C.;Jian, C.-S.;Wang, R.-Y. |
| 國立臺灣科技大學 |
2013 |
Simulation and temperature rise analysis for nanocutting sapphire workpiece with quasi-steady molecular statics method
|
Lin, Z.-C.;Hsu, Y.-C. |
| 國立臺灣科技大學 |
2013 |
Establishment and analysis of tapping mode atomic force microscopy simulative measurement model affected by external environment vibration
|
Lin, Z.-C.;Chou, M.-H. |
| 國立臺灣科技大學 |
2013 |
Investigation of the abrasive removal depth for bowl-shaped structure of sapphire wafer under compensated chemical mechanical polishing
|
Lin, Z.C.;Wang, R.Y. |
| 國立臺灣科技大學 |
2012 |
Analysis on the temperature rise produced by plastic deformation heat for nanoscale orthogonal cutting of copper workpiece
|
Lin, Z.-C.;Hsu, Y.-C.;Chen, L.-K. |
| 國立臺灣科技大學 |
2012 |
A grey weighting density-based clustering algorithm for LAO wafer defect inspection
|
Huang, M.-L.;Tsai, M.-J.;Chen, C.C.;Lin, S.C.;Lin, Z.C. |
| 國立臺灣科技大學 |
2012 |
A calculating method for the fewest cutting passes on sapphire substrate at a certain depth using specific down force energy with an AFM probe
|
Lin, Z.-C.;Hsu, Y.-C. |
| 國立臺灣科技大學 |
2012 |
A study of material removal amount of sapphire wafer in application of chemical mechanical polishing with different polishing pads
|
Lin, Z.-C.;Huang, W.-S.;Tsai, J.-S. |
| 國立臺灣科技大學 |
2012 |
Analytical study of simulated nanoscale abrasive cutting of sapphire substrate by three dimensional quasi-steady molecular statics
|
Lin, Z.-C.;Wang, R.-Y. |
