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Showing items 1-3 of 3 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立交通大學 |
2017-04-21T06:56:30Z |
Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers
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Cheng, Hsi-Kuei; Lin, Yu-Jie; Chen, Chih-Ming; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng |
國立交通大學 |
2015-07-21T08:29:25Z |
Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing
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Cheng, Hsi-Kuei; Lin, Yu-Jie; Chang, Hou-Chien; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming |
國立交通大學 |
2014-12-08T15:35:56Z |
Effect of polyimide baking on bump resistance in flip-chip solder joints
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Cheng, Hsi-Kuei; Feng, Shien-Ping; Lai, Yi-Jen; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming |
Showing items 1-3 of 3 (1 Page(s) Totally) 1 View [10|25|50] records per page
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