| 國立成功大學 |
2023 |
Effect of Bi content on the microstructure and mechanical properties of Sn-Bi-Zn-In alloy; [Sn-Bi-Zn-In 合金の微細構造と機械的特性に対する Bi 含有量の影響]
|
Nakawaki, H.;Tatsumi, H.;Nitta, S.;Yang, C.-H.;Lin, S.-K.;Nishikawa, H. |
| 國立成功大學 |
2023 |
The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy
|
Nakawaki, H.;Tatsumi, H.;Yang, C.;Lin, S.;Nishikawa, H. |
| 國立成功大學 |
2023 |
How to enhance Sn-Bi low-temperature solder by alloying?
|
Lin, S.-K.;Yang, C.-H.;Liu, Y.-C.;Hirata, Y.;Nishikawa, H. |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:20Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:23Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 國立成功大學 |
2022 |
High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling1
|
Yang, C.-H.;Liu, Y.-C.;Hirata, Y.;Nishikawa, H.;Lin, S.-K. |
| 國立成功大學 |
2022 |
Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging
|
Nishikawa, H.;Hirata, Y.;Yang, C.-H.;Lin, S.-K. |
| 國立成功大學 |
2022 |
Effect of low Bi content on mechanical properties of Sn-Bi-Zn-In alloy and its joint with Cu
|
Nishikawa, H.;Hirata, Y.;Yang, C.-H.;Lin, S.-K. |
| 國立成功大學 |
2022 |
Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders
|
Yang, C.-H.;Liu, Y.-C.;Hirata, Y.;Nishikawa, H.;Lin, S.-K. |
