English  |  正體中文  |  简体中文  |  2830339  
???header.visitor??? :  32588701    ???header.onlineuser??? :  5311
???header.sponsordeclaration???
 		 
???search.scope??? ???search.advance???
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
???ui.leftmenu.abouttair???
???ui.leftmenu.explanation???

???ui.leftmenu.bartitle???
Repositories
Author
Title
Date
???ui.leftmenu.statisticschart???
???ui.leftmenu.realtimefacts???
???ui.leftmenu.trend???

???index.news???
2019臺灣學術機構典藏
研討會
機構典藏系統RC7版本已
發佈

???ui.leftmenu.copyrighttitle???
???ui.leftmenu.copyrightpublisher???
???ui.leftmenu.copyrightconference???

???ui.leftmenu.link???
機構典藏計畫網站
ROAR
OpenDOAR
SHERPA
OAIster
JAIRO
Ira
DSPACE
RWWR
臺大學術典藏NTU Scholars
???tair.name??? >  ???browser.page.title.author???

"s l fu"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1??? ???jsp.browse.items-by-author.order2???

Showing items 1-15 of 15  (1 Page(s) Totally)
1 
View [10|25|50] records per page

Institution Date Title Author
義守大學 2014-04 Nanoscale Bondability between Cu-Al Intermetallic Compound for Cu Wirebonding H.C. Hsu;J.H. Chien;J.S. Huang;L.M. Chu;S.L. Fu
義守大學 2013-04 An Investigation on Nanoscale Tensile Mechanical Properties for Pd-coated Copper Wire H.C. Hsu;J.H. Chien;L.M. Chu;S.P. Ju;Y.T. Feng;S.L. Fu
義守大學 2013-04 Nanoscale Interfacial Frictional Behavior on Copper-Aluminum Intermetallic Compound H.C. Hsu;L.M. Chu;J.H. Chien;C.Y. Wang;S.L. Fu;M.S. Bair
義守大學 2009-06 Comparison between die attach film (DAF) and film over wire (FOW) on stack-die CSP application C.L. Chung;C.W. Ku;H.C. Hsu;S. L. Fu
義守大學 2008-10 Characteristic of the Wire-Penetration Films for Stack-Die CSP Application C.L. Chung;H.C. Hsu;S. L. Fu
義守大學 2002-12 Environmental friendly CSP C.L. Chung;Penny Kao;S. L. Fu;Steven Chou;Alex Lu;R.B. Tsai;Y.J. lee;M.L.Huang;Peter Ku
南台科技大學 1996 A Hybrid Algorithm for the Linear Placement Problem Lee, J.; J.H. Chou; S.L. Fu
義守大學 1996 Low Temperature Sinterable Multilayer Glass-ceramic Substrates S.L. Fu;L.S. Chen;J.N. Lu
南台科技大學 1995-02 New Approach for the Ordering of Gate Permutation in One-Dimensional Logic Arrays J. Lee; J. H. Chou; S. L. Fu;黎靖
南台科技大學 1995 Reliability and Wirability Optimizations for Module Placement on a Convectively Cooled Printed Wiring Board J. Lee; J. H. Chou; S. L. Fu;黎靖
南台科技大學 1995 Placement with Reliability and Wireability for Power Hybrid Circuits Lee, J.; S. L. Fu,; J. H. Chou; 黎靖
南台科技大學 1992 A Placement Procedure with Thermal Considerations for High Power Integrated Circuits Lee, J.; J.H. Chou; S.L. Fu
南台科技大學 1991 Enhancing Heat Transfer Rate for Simulated Packages by Vortex Generators J. Lee; S. L. Fu; J. H. Chou; 黎靖;傅勝利;周榮華
南台科技大學 1991 A Placement Procedure with Thermal Considerations for High Power Integrated Circuits Lee, J.; J.H. Chou; S.L. Fu
南台科技大學 1989-12-08 Enhancing Heat Transfer Rate for Simulated Packages by Vortex Generators 黎靖; J. Lee;S. L. Fu; J. H. Chou

Showing items 1-15 of 15  (1 Page(s) Totally)
1 
View [10|25|50] records per page

DSpace Software Copyright © 2002-2004  MIT   &  Hewlett-Packard   /   Enhanced by   NTU Library IR team