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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
義守大學 2014-04 Nanoscale Bondability between Cu-Al Intermetallic Compound for Cu Wirebonding H.C. Hsu;J.H. Chien;J.S. Huang;L.M. Chu;S.L. Fu
義守大學 2013-04 An Investigation on Nanoscale Tensile Mechanical Properties for Pd-coated Copper Wire H.C. Hsu;J.H. Chien;L.M. Chu;S.P. Ju;Y.T. Feng;S.L. Fu
義守大學 2013-04 Nanoscale Interfacial Frictional Behavior on Copper-Aluminum Intermetallic Compound H.C. Hsu;L.M. Chu;J.H. Chien;C.Y. Wang;S.L. Fu;M.S. Bair
義守大學 2009-06 Comparison between die attach film (DAF) and film over wire (FOW) on stack-die CSP application C.L. Chung;C.W. Ku;H.C. Hsu;S. L. Fu
義守大學 2008-10 Characteristic of the Wire-Penetration Films for Stack-Die CSP Application C.L. Chung;H.C. Hsu;S. L. Fu
義守大學 2002-12 Environmental friendly CSP C.L. Chung;Penny Kao;S. L. Fu;Steven Chou;Alex Lu;R.B. Tsai;Y.J. lee;M.L.Huang;Peter Ku
南台科技大學 1996 A Hybrid Algorithm for the Linear Placement Problem Lee, J.; J.H. Chou; S.L. Fu
義守大學 1996 Low Temperature Sinterable Multilayer Glass-ceramic Substrates S.L. Fu;L.S. Chen;J.N. Lu
南台科技大學 1995-02 New Approach for the Ordering of Gate Permutation in One-Dimensional Logic Arrays J. Lee; J. H. Chou; S. L. Fu;黎靖
南台科技大學 1995 Reliability and Wirability Optimizations for Module Placement on a Convectively Cooled Printed Wiring Board J. Lee; J. H. Chou; S. L. Fu;黎靖
南台科技大學 1995 Placement with Reliability and Wireability for Power Hybrid Circuits Lee, J.; S. L. Fu,; J. H. Chou; 黎靖
南台科技大學 1992 A Placement Procedure with Thermal Considerations for High Power Integrated Circuits Lee, J.; J.H. Chou; S.L. Fu
南台科技大學 1991 Enhancing Heat Transfer Rate for Simulated Packages by Vortex Generators J. Lee; S. L. Fu; J. H. Chou; 黎靖;傅勝利;周榮華
南台科技大學 1991 A Placement Procedure with Thermal Considerations for High Power Integrated Circuits Lee, J.; J.H. Chou; S.L. Fu
南台科技大學 1989-12-08 Enhancing Heat Transfer Rate for Simulated Packages by Vortex Generators 黎靖; J. Lee;S. L. Fu; J. H. Chou

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