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Institution Date Title Author
義守大學 2018-02 3D堆疊TSV的電氣特性之研究 林仕鈞; Shin-Chun Lin
義守大學 2018-01 Machine-Learning Approach in Detection and Classification for Defects in TSV-Based 3-D IC Yu-Jung Huang;Chung-Long Pan;Shin-Chun Lin;Mei-Hui Guo
義守大學 2017-10 Electrical modeling of 3D stacked TSV Zhi-Min Zhang;Shin-Chun Lin;Chung-Long Pan;Yu-Jung Huang

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