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"tsai tm"的相关文件
显示项目 16-25 / 36 (共4页)
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| 國立交通大學 |
2014-12-08T15:40:06Z |
Dielectric characteristics of low-permittivity silicate using electron beam direct patterning for intermetal dielectric applications
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Liu, PT; Chang, TC; Tsai, TM; Lin, ZW; Chen, CW; Chen, BC; Sze, SM |
| 國立交通大學 |
2014-12-08T15:39:45Z |
CMP of low-k methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applications
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Chang, TC; Tsai, TM; Liu, PT; Chen, CW; Yan, ST; Aoki, H; Chang, YC; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:39:43Z |
Investigation of the electrical properties and reliability of amorphous SiCN
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Chen, CW; Chang, TC; Liu, PT; Tsai, TM; Huang, HC; Chen, JM; Tseng, CH; Liu, CC; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:39:42Z |
CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications
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Chang, TC; Tsai, TM; Liu, PT; Chen, CW; Yan, ST; Aoki, H; Chang, YC; Tseng, T |
| 國立交通大學 |
2014-12-08T15:39:16Z |
Method to improve chemical-mechanical-planarization polishing rate of low-k methyl-silsesquiazane for ultralarge scale integrated interconnect application
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Chang, TC; Tsai, TM; Liu, PT; Yan, ST; Chang, YC; Aoki, H; Sze, SM; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:37:10Z |
Study on etching profile of nanoporous silica
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Chen, CW; Chang, TC; Liu, PT; Tsai, TM; Wu, HH; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:37:10Z |
Study on the effect of electron beam curing on low-K porous organosilicate glass (OSG) material
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Chang, TC; Tsai, TM; Liu, PT; Chen, CW; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:37:10Z |
Cu-penetration induced breakdown mechanism for a-SiCN
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Chen, CW; Liu, PT; Chang, TC; Yang, JH; Tsai, TM; Wu, HH; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:37:06Z |
Effects of oxygen plasma ashing on barrier dielectric SiCN film
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Chen, CW; Chang, TC; Liu, PT; Tsai, TM; Tseng, TY |
| 國立交通大學 |
2014-12-08T15:36:06Z |
Electrical degradation of N-channel poly-Si TFT under AC stress
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Chen, CW; Chang, TC; Liu, PT; Lu, HY; Tsai, TM; Weng, CF; Hu, CW; Tseng, TY |
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