臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

	English \| 正體中文 \| 简体中文 \| Total items :2828323
	Visitors : 32168204 Online Users : 4250 Project Commissioned by the Ministry of Education Project Executed by National Taiwan University Library

Scope

Adv. Search

Login

Administrator

臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

About TAIR
	About TAIR

Browse By
	Institution
	Author
	Title
	Date
	Statistics Chart
	Institution Facts
	Trend

News
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

Copyright
	Publisher & Journal Policy
	TAIR Copyright Conference Minutes

Related Links
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"wan zhen hsieh"

Return to Browse by Author
Sorting by Title	Sort by Date

Showing items 1-10 of 22 (3 Page(s) Totally)
1 2 3 > >>
View [10|25|50] records per page

Institution	Date	Title	Author
元智大學	Sep-18	TEM Characterization of Cu Self-annealing and Direct Proof of Pinhole Formation Mechanism in a Cu Film	Cheng-En Ho; Chang-Chih Chen; Cheng-Hsien Yang; Pei-Tzu Lee; Wan-Zhen Hsieh; Ying-Syuan Wu
元智大學	Sep-16	Real-time Study of Electromigration in Sn Blech Structure	Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Pei-Tzu Lee
元智大學	Nov-14	Pronounced Effects of Ni(P) Thickness on the Interfacial Reaction and High Impact Resistance of the Solder/Au/Pd(P)/Ni(P)/Cu Reactive System	Cheng-En Ho; Chia-Wei Fan; Wan-Zhen Hsieh
元智大學	Nov-14	Electron Backscatter Diffraction Analysis on the Microstructures of Electrolytic Cu Deposition in the Through Hole Filling Process: Butterfly Deposition Mode	Cheng-En Ho; Wan-Zhen Hsieh; Chang-Chih Chen; Ming-Kai Lu
元智大學	Mar-18	High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes	Cheng-En Ho; Wan-Zhen Hsieh; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo
元智大學	Jun-22	Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure	Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Shao-Chin Tseng; Mau-Tsu Tang; Ching-Yu Chiang; C.R. Kao; Cheng-En Ho
元智大學	Jun-17	High-speed Cu Electrodeposition and Its Solderability	Pei-Tzu Lee; Ying-Syuan Wu; Pin-Chung Lin; Chang-Chih Chen; Wan-Zhen Hsieh; Cheng-En Ho
元智大學	Jan-19	Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy	Yu-Hsuan Huang; Wan-Zhen Hsieh; Pei-Tzu Lee; Ying-Syuan Wu; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Jan-15	Depletion and Phase Transformation of a Submicron Ni(P) Film in the Early Stage of Soldering Reaction between Sn-Ag-Cu and Au/Pd(P)/Ni(P)/Cu	Cheng-En Ho; Wan-Zhen Hsieh; Tsung-Hsun Yang
元智大學	Jan-15	Interfacial Reaction and Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition	Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Ting-Chun Yeh; Tsai-Tung Kuo

Showing items 1-10 of 22 (3 Page(s) Totally)
1 2 3 > >>
View [10|25|50] records per page