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Showing items 1-12 of 12 (1 Page(s) Totally)
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| 國立交通大學 |
2015-07-21T08:28:43Z |
Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium
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Su, Yin-Hsien; Wu, Sze-Ann; Wu, Chia-Yang; Wang, Ying-Lang; Lee, Wen-Hsi |
| 國立成功大學 |
2015-03 |
Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium
|
Su, Yin-Hsien; Wu, Sze-Ann; Wu, Chia-Yang; Wang, Ying-Lang; Lee, Wen-Hsi |
| 國立交通大學 |
2014-12-08T15:37:57Z |
Effect of Annealing on the Microstructure and Electrical Property of RuN Thin Films
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Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:31:06Z |
Investigation the Electroplating Behavior of Self Formed CuMn Barrier
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Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:22:12Z |
Investigation of the Galvanic Effect between RuN Barriers and Cu Seed Layers
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Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2014-03 |
A Study of Cu/CuMn Barrier for 22-nm Semiconductor Manufacturing
|
Wu, Sze-Ann; Cheng, Yi-Lung; Wu, Chia-Yang; Lee, Wen-Hsi |
| 國立成功大學 |
2013-08 |
Investigation the Electroplating Behavior of Self Formed CuMn Barrier
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Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2012-11-25 |
A study on annealing mechanisms with different manganese contents in CuMn alloy
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Wu, Chia-Yang; Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2012-11-14 |
提升應用於次30奈米金屬化製程無種晶阻障層之阻障特性以及熱穩定性
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吳家揚; Wu, Chia-Yang |
| 國立成功大學 |
2012 |
Copper Electrodeposition on Ru-N Barrier with Various Nitrogen Content for 22 nm Semiconductor Manufacturing Application
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Wu, Chia-Yang; Wang, Yu-Sheng; Lee, Wen-Hsi |
| 國立成功大學 |
2011 |
Effect of Annealing on the Microstructure and Electrical Property of RuN Thin Films
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Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立暨南國際大學 |
2010 |
家族公司持股變化、機構投資人持股與公司價值關聯性之研究
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吳家揚; Wu, Chia-Yang |
Showing items 1-12 of 12 (1 Page(s) Totally)
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