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| 國立交通大學 |
2016-03-28T00:05:44Z |
Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications
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Chang, Chih-Wei; Huang, Po-Tsang; Chou, Lei-Chun; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Chiou, Jin-Chern; Hwang, Wei; Lee, Yen-Chi; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming |
| 國立交通大學 |
2015-12-02T03:00:57Z |
Integrated Microprobe Array and CMOS MEMS by TSV Technology for Bio- Signal Recording Application
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Chou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Wu, Shang-Lin; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2015-12-02T03:00:54Z |
A TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe Array
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Chou, Lei-Chun; Lee, Shih-Wei; Cheng, Chuan-An; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:05Z |
A TSV-Based Bio-Signal Package With mu-Probe Array
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Chou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
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