|
English
|
正體中文
|
简体中文
|
总笔数 :0
|
|
造访人次 :
51814611
在线人数 :
905
教育部委托研究计画 计画执行:国立台湾大学图书馆
|
|
|
"wu ic wu i chih"的相关文件
Showing items 1-2 of 2 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 中國文化大學 |
2018-01 |
Experimental location of damage in microelectronic solder joints after a board level reliability evaluation
|
Wu, IC (Wu, I-Chih); Wang, MH (Wang, Min-Haw); Jang, LS (Jang, Ling-Sheng) |
| 中國文化大學 |
2018 |
Characteristics of Lock-in Thermography Signal from Solder Bump Cracking in Wafer-level Chip Scale Packaging for Internet of Things Applications
|
Wu, IC (Wu, I-Chih); Huang, YJ (Huang, Yu-Jung); Wang, MH (Wang, Min-Haw); Jang, LS (Jang, Ling-Sheng) |
Showing items 1-2 of 2 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
