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Showing items 1-5 of 5 (1 Page(s) Totally)
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| 國立成功大學 |
2022-07 |
Charge-Discharge Mechanism of High-Entropy Co-Free Spinel Oxide Toward Li+ Storage Examined Using Operando Quick-Scanning X-Ray Absorption Spectroscopy
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Luo;Xu-Feng;Patra;Jagabandhu;Chuang;Wei-Tsung;Nguyen;Xuyen, Thi;Ting;Jyh-Ming;Li;Ju;Pao;Chih-Wen;Chang;Jeng-Kuei |
| 國立交通大學 |
2019-04-03T06:41:32Z |
Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
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Chang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立交通大學 |
2019-04-02T05:59:55Z |
Strain-induced superconducting pair density wave states in graphene
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Xu, Feng; Chou, Po-Hao; Chung, Chung-Hou; Lee, Ting-Kuo; Mou, Chung-Yu |
| 國立交通大學 |
2018-08-21T05:56:50Z |
Study of Discrete Voids Formation in Flip-Chip Solder Joints due to Electromigration Using In-Situ 3D Laminography and Finite-Element Modeling
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Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立交通大學 |
2017-04-21T06:55:10Z |
Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling
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Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
Showing items 1-5 of 5 (1 Page(s) Totally)
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