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"yen shi chern"
Showing items 11-20 of 30 (3 Page(s) Totally)
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| 淡江大學 |
2003-05 |
A study of copper chemical mechanical polishing in urea–hydrogen peroxide slurry by electrochemical impedance spectroscopy
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Tsai, Tzu-hsuan; Wu, Yung-fu; Yen, Shi-chern |
| 淡江大學 |
2003-04-15 |
Localized Corrosion Effects and Modifications of Acidic and Alkaline Slurries on Copper Chemical Mechanical Polishing
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Tsai, Tzu-hsuan; Yen, Shi-chern |
| 國立臺灣大學 |
2003 |
Localized corrosion effects and modifications of acidic and alkaline slurries on copper chemical mechanical polishing
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Tsai, Tzu-Hsuan; Yen, Shi-Chern |
| 國立臺灣大學 |
2003 |
A study of copper chemical mechanical polishing in urea–hydrogen peroxide slurry by electrochemical impedance spectroscopy
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Tsai, Tzu-Hsuan; Wu, Yung-Fu; Yen, Shi-Chern |
| 國立臺灣大學 |
2001 |
Effects of additives and chelating agents on electroless copper plating
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Lin, Yi-Mao; Yen, Shi-Chern |
| 國立臺灣大學 |
1995 |
Theoretical analysis of film uniformity in spinning processes
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Wang, Chih-Ta; Yen, Shi-Chern |
| 國立臺灣大學 |
1994 |
在外加強制對流下旋轉盤電極上之質量傳送研究(二)
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顏溪成; Yen, Shi-Chern |
| 國立臺灣大學 |
1993 |
在外加強制對流下旋轉盤電極上之質量傳送研究(一)
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顏溪成; Yen, Shi-Chern |
| 國立臺灣大學 |
1992 |
Mass transfer and fluid flow due to a rotating disk with external forced convection
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Yen, Shi-Chern; Wang, Jin-Shen |
| 國立臺灣大學 |
1992 |
Experimental Mass Transfer at a Forced-Convective Rotating-Disk Electrode
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Yen, Shi-Chern; Wang, Jin-Shen; Chapman, Thomas W. |
Showing items 11-20 of 30 (3 Page(s) Totally)
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