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"young wen bin"
Showing items 1-25 of 40 (2 Page(s) Totally)
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| 國立成功大學 |
2020-10 |
Characteristic study of bamboo fibers in preforming
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Chiu, Hsuan-Hao;Young, Wen-Bin |
| 國立成功大學 |
2015-09 |
The mechanical and fire safety properties of bamboo fiber reinforced polylactide biocomposites fabricated by injection molding
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Young, Wen-Bin; Tsao, Yu-Chi |
| 國立成功大學 |
2014-07 |
The application of carbon black and printing ink technology in molded interconnect devices
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Liu, Ren-Hao; Young, Wen-Bin |
| 國立成功大學 |
2014-06-01 |
Modeling and numerical study of thermal-compression bonding in the packaging process using NCA
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Chang, Ching-Ho; Young, Wen-Bin |
| 國立成功大學 |
2013-12 |
A Two-layer Model for the Simulation of the VARTM Process with Resin Distribution Layer
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Young, Wen-Bin |
| 國立成功大學 |
2013-03 |
Three-dimensional modeling of the advanced grid stiffened structures in the co-curing process
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Young, Wen-Bin |
| 國立成功大學 |
2013-02-01 |
The effective permeability of the underfill flow domain in flip-chip packaging
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Yang, Connie; Young, Wen-Bin |
| 國立成功大學 |
2013-01 |
Study on Bump Arrangement to Accelerate the Underfill Flow in Flip-Chip Packaging
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Lin, Shih-Wei; Young, Wen-Bin |
| 國立成功大學 |
2012-06 |
Structural Analysis and Design of the Composite Wind Turbine Blade
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Wu, Wen-Hsiang; Young, Wen-Bin |
| 國立成功大學 |
2011-07 |
Effect on Filling Time for a Non-Newtonian Flow During the Underfilling of a Flip Chip
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Young, Wen-Bin |
| 國立成功大學 |
2011-04 |
Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA
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Chang, Ching-Ho; Young, Wen-Bin |
| 國立成功大學 |
2009-09 |
Analysis of the filling capability to the microstructures in micro-injection molding
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Lin, Huang-Ya; Young, Wen-Bin |
| 國立成功大學 |
2009-04 |
Development of a Helicopter Landing Gear Prototype using Resin Infusion Molding
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Young, Wen-Bin |
| 國立成功大學 |
2008-03 |
Analysis of the isothermal compression in nanoimprint lithography assuming a power-law fluid
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Hsin, I. C.; Young, Wen-Bin |
| 國立成功大學 |
2007-09 |
Analysis of filling distance in cylindrical microfeatures for microinjection molding
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Young, Wen-Bin |
| 國立成功大學 |
2007-07-15 |
Micro-injection molding with the infrared assisted mold heating system
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Yu, Ming-Ching; Young, Wen-Bin; Hsu, Pe-Ming |
| 國立成功大學 |
2006-08 |
Underfill of flip-chip: The effect of contact angle and solder bump arrangement
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Young, Wen-Bin; Yang, Wen-Lin |
| 國立成功大學 |
2006-07 |
Analysis of the residual stresses in the process of nanoimprint lithography
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Young, Wen-Bin |
| 國立成功大學 |
2006-03 |
The thrust and lift of an ornithopter's membrane wings with simple flapping motion
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Lin, Che-Shu; Hwu, Chyanbin; Young, Wen-Bin |
| 國立成功大學 |
2005-10 |
Effect of process parameters on injection compression molding of pickup lens
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Young, Wen-Bin |
| 國立成功大學 |
2005-10 |
Study on residual stresses of thin-walled injection molding
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Wang, Tong-Hong; Young, Wen-Bin |
| 國立成功大學 |
2005-09 |
Experimental study on the filling of a micro injection molding with cylindrical dot patterns
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Chang, H. C.; Young, Wen-Bin |
| 國立成功大學 |
2005-05 |
Simulation of the filling process in molding components with micro channels
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Young, Wen-Bin |
| 國立成功大學 |
2005-02-05 |
Analysis of the nanoimprint lithography with a viscous model
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Young, Wen-Bin |
| 國立成功大學 |
2004-06 |
A model for underfill viscous flow considering the resistance induced by solder bumps
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Lai, Chyi-Lang; Young, Wen-Bin |
Showing items 1-25 of 40 (2 Page(s) Totally)
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