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"young wen bin"的相关文件
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| 國立成功大學 |
2020-10 |
Characteristic study of bamboo fibers in preforming
|
Chiu, Hsuan-Hao;Young, Wen-Bin |
| 國立成功大學 |
2015-09 |
The mechanical and fire safety properties of bamboo fiber reinforced polylactide biocomposites fabricated by injection molding
|
Young, Wen-Bin; Tsao, Yu-Chi |
| 國立成功大學 |
2014-07 |
The application of carbon black and printing ink technology in molded interconnect devices
|
Liu, Ren-Hao; Young, Wen-Bin |
| 國立成功大學 |
2014-06-01 |
Modeling and numerical study of thermal-compression bonding in the packaging process using NCA
|
Chang, Ching-Ho; Young, Wen-Bin |
| 國立成功大學 |
2013-12 |
A Two-layer Model for the Simulation of the VARTM Process with Resin Distribution Layer
|
Young, Wen-Bin |
| 國立成功大學 |
2013-03 |
Three-dimensional modeling of the advanced grid stiffened structures in the co-curing process
|
Young, Wen-Bin |
| 國立成功大學 |
2013-02-01 |
The effective permeability of the underfill flow domain in flip-chip packaging
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Yang, Connie; Young, Wen-Bin |
| 國立成功大學 |
2013-01 |
Study on Bump Arrangement to Accelerate the Underfill Flow in Flip-Chip Packaging
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Lin, Shih-Wei; Young, Wen-Bin |
| 國立成功大學 |
2012-06 |
Structural Analysis and Design of the Composite Wind Turbine Blade
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Wu, Wen-Hsiang; Young, Wen-Bin |
| 國立成功大學 |
2011-07 |
Effect on Filling Time for a Non-Newtonian Flow During the Underfilling of a Flip Chip
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Young, Wen-Bin |
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