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"young wen bin"
Showing items 11-20 of 40 (4 Page(s) Totally)
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| 國立成功大學 |
2011-04 |
Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA
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Chang, Ching-Ho; Young, Wen-Bin |
| 國立成功大學 |
2009-09 |
Analysis of the filling capability to the microstructures in micro-injection molding
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Lin, Huang-Ya; Young, Wen-Bin |
| 國立成功大學 |
2009-04 |
Development of a Helicopter Landing Gear Prototype using Resin Infusion Molding
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Young, Wen-Bin |
| 國立成功大學 |
2008-03 |
Analysis of the isothermal compression in nanoimprint lithography assuming a power-law fluid
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Hsin, I. C.; Young, Wen-Bin |
| 國立成功大學 |
2007-09 |
Analysis of filling distance in cylindrical microfeatures for microinjection molding
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Young, Wen-Bin |
| 國立成功大學 |
2007-07-15 |
Micro-injection molding with the infrared assisted mold heating system
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Yu, Ming-Ching; Young, Wen-Bin; Hsu, Pe-Ming |
| 國立成功大學 |
2006-08 |
Underfill of flip-chip: The effect of contact angle and solder bump arrangement
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Young, Wen-Bin; Yang, Wen-Lin |
| 國立成功大學 |
2006-07 |
Analysis of the residual stresses in the process of nanoimprint lithography
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Young, Wen-Bin |
| 國立成功大學 |
2006-03 |
The thrust and lift of an ornithopter's membrane wings with simple flapping motion
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Lin, Che-Shu; Hwu, Chyanbin; Young, Wen-Bin |
| 國立成功大學 |
2005-10 |
Effect of process parameters on injection compression molding of pickup lens
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Young, Wen-Bin |
Showing items 11-20 of 40 (4 Page(s) Totally)
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